Bump Adapters allow SMT adaptation of fine pitch devices.

Press Release Summary:



Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with ½ oz copper traces on both sizes. Non-solder mask defined pads are finished with electroless nickel immersion gold.



Original Press Release:



Fine Pitch Bump Adapters from Aries Allow for SMT Adaptation of TSSOP, QFP and other Fine-Pitch Devices



Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch.

These unique Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010" (0.25 mm) on the adapter bottom. The adapters feature pads on the component side designed to accept any device on any pitch (0.5 mm or greater) and easily route the signals for packages including TSSOP, QFP and other fine-pitch devices down to 0.40 mm.

In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. This extra available space allows for easy conversion of the original design saving both time and money.

The Aries' Fine Pitch Bump Adapter boards are 0.032" (0.813 mm) thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The adapters can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free.

The new adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" (0.076 mm) can be used.

Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turnkey solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity. For more information regarding an adapter to meet specific needs, consult the Aries factory.

Pricing for a 64 lead adapter starts at $25.67. Delivery is 15 working days.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: www.arieselec.com, Data sheet #18107-http://www.arieselec.com/products/18107.pdf. Europe Email: europe@arieselec.com.

UPCOMING TRADESHOW: BiTS Workshop, March 6-9, 2011 - Mesa, AZ

READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.

Headquartered in Bristol, Pa., Aries Electronics Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the "intelligent" Correct-A-Chip(TM) product line; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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