Rapid Adoption Demonstrates Growing Demand for Higher Speed and Increased Bandwidth in the Data Center
IRVINE, Calif. – Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced rapid adoption of its latest 40/50/100 Gigabit Ethernet (GbE) PHY in pluggable QSFP+ optical and DAC modules. Multiple original equipment manufacturers (OEMs) and original device manufacturers (ODMs) have adopted the devices for immediate implementation. Broadcom will showcase its latest innovations for high speed interconnects products at the OFC Technical Conference in Los Angeles, California, March 24-26. For more news, visit Broadcom's Newsroom.
To meet rising data traffic demands, network operators are looking for cost and performance improvements in the data center that can leverage legacy cabling. Optimized for use in 40G quad small form-factor pluggable (QSFP) optics and direct attach copper (DAC) applications, the Broadcom PAM4 devices enable transmission rates of 40/50 gigabits per second (Gbps) over the existing infrastructure.
"The rapid adoption and support of our PAM4 technology by our leading customers and partners reinforces Broadcom's leadership in wired physical layer devices," said Lorenzo Longo, Broadcom, Vice President and General Manager, Physical Layer Products. "Our devices are designed to support higher data throughput over existing low bandwidth channels by transmitting more bits per symbol, significantly reducing cost by eliminating the need for expensive interconnect media."
"We are pleased to be working with Broadcom to deliver future-proof technology using their latest PAM4 offering," said Chris Lyon, Amphenol Product Manager. "Using the BCM82004 in a 1X40G PAM4 QSFP implementation, we are able to meet our customers' expectations for excellence, performance and scalability."
"Using Broadcom's new PAM4 technology has enabled us to provide our data center customers with high performance, dependability and more flexibility than ever before," said Arash Behziz, TE System Architecture Group Technologist. "The 40G Direct Attach Copper provides cost savings, reduces infrastructure management issues and positions us for long-term success."
"Broadcom and Molex share a long-term partnership in today's highly competitive communications environment," said Zach Bradford, Molex Manager of New Product Development. "Coupled with our Impel product line, Broadcom's latest PAM4 technology supports high data rate applications and delivers exceptional performance - giving our customers the right tools they need to drive data speed growth."
At OFC 2015, Broadcom and its ecosystem partners will demonstrate:
Web Site: http://www.broadcom.com