Bluetooth Package provides turnkey solution for laptops.
Press Release Summary:
All-in-One Bluetooth Wireless Technology Package provides integrated Bluetooth customer support solution for laptop PCs that solves coexistence concerns of 2.4 GHz frequency band when integrating Bluetooth technology. Bluetooth V1.2-compliant module implements Adaptive Frequency Hopping and Enhanced Synchronous Channel Operation, while chip antenna provides dedicated connector interface with PC motherboard. Package also includes Bluetooth protocol stacks.
Original Press Release:
TAIYO YUDEN's New All-In-One Bluetooth. Wireless Technology Package Provides "Turnkey" Solution for Laptop PCs
Bluetooth V1.2-compliant module, chip antenna and protocol stacks support
Intel's latest coexistence specification and customer requirements
San Diego, CA-June 1, 2004-TAIYO YUDEN (U.S.A.), INC. today announced the availability of a new, fully integrated Bluetooth customer support solution for laptop PCs that solves "coexistence" concerns of the 2.4 GHz frequency band when integrating Bluetooth technology. TAIYO YUDEN's All-in-One Bluetooth Wireless Technology Package includes the company's new Bluetooth V1.2-compliant module, innovative chip antenna and complete Bluetooth protocol stacks. Now, the many design challenges of integrating RF technology, 2.4 GHz antenna, software development, testing, evaluation, Bluetooth logo certification and numerous regulatory approvals-are swiftly solved for laptop PC manufacturers by TAIYO YUDEN's "one-stop shop" customer support package.
"We're confident that our All-in-One package will reduce customers' burden of development and system integration by providing Bluetooth wireless technology in PCs," stated Dr. Yukihiro Kawada, Senior Operating Officer of TAIYO YUDEN CO., LTD. "Simplifying the tasks required for mass producing the next-generation of wireless products will lead to further adoption of Bluetooth wireless technology in various devices."
The first element of the All-in-One package, the Bluetooth V1.2-compliant Coexistence Module, implements new functions such as Faster Connection, AFH (Adaptive Frequency Hopping), and eSCO (Enhanced Synchronous Channel Operation). It also supports Intel. WCS Phase-II Coexistence specification, jointly developed with CSR and Silicon Wave, in its PRO Wireless Internet connection cards that will be part of the next-generation Centrino(TM) platform. This technology will allow PC manufacturers to experience optimized throughput for their wireless applications, enabling both Bluetooth (2.4GHz ISM band) and Wireless LAN (802.11b/g) technology to operate simultaneously on the same laptop PC.
The second element of the All-in-One solution, the antenna, provides a dedicated connector interface with the PC motherboard. Furthermore, it is equipped with Bluetooth certification and regulatory approvals for each country of destination, thus saving PC manufacturers the burden of undergoing the regulatory approval process themselves.
The third element of the All-in-One package is the Bluetooth Protocol Stack, which enables the module hardware to operate in laptop or desktop PC system. In addition to Intel's coexistence technology, this software is fully compliant with the latest Bluetooth Specification, V1.2. TAIYO YUDEN's solution enables PC manufacturers to immediately support key peripherals, such as keyboard, mouse, and other versatile Bluetooth functions, including audio/video applications. The software evaluation kit will be available Q304, and may be downloaded at www.ty-top.com (note: access key required).
Price: US$50.00 / Set-evaluation sample of Bluetooth V1.2 coexistence module, antenna, Bluetooth protocol stacks
Availability: Third Quarter 2004
Delivery: 2-3 Weeks ARO
About Taiyo Yuden
Now in its 54th year, Tokyo-based TAIYO YUDEN CO., LTD. is a worldwide manufacturer of surface-mount and leaded passive components, Bluetooth modules, power electronics modules, power supplies, and recordable digital media. With approximately 50% of the worldwide market in high-frequency multilayer chip inductors used in cellular phone applications, the company reports annual sales of nearly US$1.4B. Worldwide, TAIYO YUDEN employs more than fifteen thousand people, and the company's North American affiliate, TAIYO YUDEN (U.S.A.), INC., operates sales and engineering offices in: Chicago, IL; Raleigh, NC; Irving, TX; San Jose, CA; and San Diego County.
The Bluetooth. word mark and logos are owned by the Bluetooth SIG, Inc. Other trademarks and trade names are those of their respective owners.
