(Albany, NY) – Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be participating and speaking at the PCB Supply Chain Leadership Meeting. This is an exclusive, invitation only event that takes place during the upcoming IPC APEX EXPO. Dr. Yin was specially asked to give an encore presentation to top executives and presidents of the IPC member companies. The PCB Supply Chain Leadership Meeting will be held Monday February 23rd from 8 am to 5 pm at the San Diego Convention Center in San Diego, California.
The PCB Supply Chain Leadership Meeting held during the IPC APEX EXPO is a time where senior-executive level management IPC members get together and address issues related to improving executive decision-making in the industry, focusing on market trends, customer requirements and the economy. The daylong meeting has several different sessions that focus on different topics of interest. Presentations will be delivered throughout the day. Dr. Wusheng Yin and YINCAE Advanced Materials are honored to be invited to attend and present at this exclusive event.
Dr. Yin will be presenting his white paper, “The Future of Solder Joint Encapsulant Adhesives.” This paper will focus on the electronic industry and the increasing interest in using solder joint encapsulants. The paper discusses how YINCAE has developed the solder joint encapsulant product family and the benefits that it can bring to a manufacturer’s assembly process.
In addition to the Leadership Meeting, YINCAE Advanced Materials, LLC will be exhibiting during IPC APEX EXPO. YINCAE staff will be on hand and available to discuss YINCAE products and address any questions. YINCAE hopes to see you there at the IPC APEX EXPO. Please visit us at booth 608!
Dr. Yin is a pioneer in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully utilized by major microelectronics product and contract manufacturers. His encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity, and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by 5 times, while reducing thermal cycling failures by 10 times, with a reduction in solder voids of up to 79%. This data translates to significant production savings for microelectronics manufacturers.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website. www.yincae.com
YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.
FOR ADDITIONAL INFORMATION CONTACT:
Phone: (518) 452-2880
YINCAE Advanced Materials, LLC
19 Walker Way, Albany, NY 12205