Dek U.S.A., Inc.
Rolling Meadows, IL 60008
Tool Package accelerates 25 micron backside wafer coating.
Equipment and tooling package enables coating of wafers with die attach materials down to 25 microns thick. It eliminates limitations on chip footprint due to chip fillet formation and resin bleed while allowing uniform deposition of materials with tolerances of Ã-
Read More »DEK's Flexible Horizon Platform and Total Process Solutions on Display at Canadian High Tech Show
Visitors to this year's Canadian High Tech Show in Toronto, Canada will see first hand how DEK's award-winning products and total process solutions philosophy are cost-effectively enabling next-generation manufacturing through high accuracy mass imaging creativity. At the upcoming event, DEK will showcase its flexible Horizon 03i screen printing platform. An unbeatable combination of performance...
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Stencils facilitate high-speed adhesive deposition.
Available in 23 x 23 and 29 x 29 in. sizes with 3 mm thickness, VectorGuard(TM) PumpPrint(TM) Stencils utilize tensioning system of VectorGuard frame, which attaches directly to acrylic PumpPrint stencils by engaging in channel routed around circumference. Stencils allow large numbers of adhesives deposits of almost any shape and size to be made on populated PCBs with sub 8 second cycle times.
Read More »Tooling Pins exert 5 g of pressure during lift.
Grid-Lok(TM) features modular array of pneumatically controlled tooling pins that conform to underside of board including contact with components. They are tipped with anti-static material, and locked independently. Conforming sequence is initiated by operator, or alternatively, in fully automatic mode, system can set profile for every product that passes through machine. Grid-Lok arrays work...
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