EV Group, Inc.

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

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Adhesives & Sealants

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

EVGÂ-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for...

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Machinery & Machining Tools

EV Group Showcases Latest Photovoltaic Manufacturing Advances at Intersolar North America 2013

SAN FRANCISCO – INTERSOLAR NORTH AMERICA - EV Group (EVG), a leading equipment supplier for photovoltaic (PV) cell and module manufacturing, including anti-reflective and anti-soiling coating, nanoimprint lithography, thin-wafer processing, wafer bonding and photolithography equipment, today announced it is showcasing its latest innovations for improving performance and reducing costs of...

Read More »
Adhesives & Sealants

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCOÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount...

Read More »
Test & Measurement

Automated Measurement System aids image sensor manufacturing.

Featuring seamless software integration with GEMINIÂ-® FB fusion wafer bonding system, EVGÂ-®40NT supports manufacture of 3D-integrated CMOS image sensors.Â- Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and...

Read More »
Adhesives & Sealants

Debonding Processes promote manufacturing flexibility.

LowTemp™ debonding platform featuresÂ- 3 room-temperature wafer debonding processes and extended material supply chain. TwoÂ- debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBONDÂ-® technology, which has been implemented into production...

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Machinery & Machining Tools

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind. - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly...

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Resist Processing System supports micro- and nano-electronics.
Machinery & Machining Tools

Resist Processing System supports micro- and nano-electronics.

Featuring robot with dual arms for accelerated wafer swapping, EVGÂ-®120 Automated Resist Processing SystemÂ- supports coating and developing applications forÂ- MEMSÂ- systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers...

Read More »
EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Electronic Components & Devices

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's GeminiÂ-® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

Read More »
Electronic Components & Devices

UV-NIL Step and Repeat System is designed for accuracy.

UV-nanoimprint lithography (UV-NIL) step and repeat system, EVG770 Gen II NIL Stepper, incorporates abilities that promote process reliability, accuracy, and pattern fidelity at decreasing feature densities. While vacuum imprinting on spun-on polymer layer eliminates defect issues caused by trapped air bubbles, optical sensors align stamp and wafer into perfect parallelism for contact-free wedge...

Read More »
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

Read More »
Adhesives & Sealants

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

EVGÂ-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for...

Read More »
Adhesives & Sealants

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCOÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount...

Read More »
Machinery & Machining Tools

EV Group Showcases Latest Photovoltaic Manufacturing Advances at Intersolar North America 2013

SAN FRANCISCO – INTERSOLAR NORTH AMERICA - EV Group (EVG), a leading equipment supplier for photovoltaic (PV) cell and module manufacturing, including anti-reflective and anti-soiling coating, nanoimprint lithography, thin-wafer processing, wafer bonding and photolithography equipment, today announced it is showcasing its latest innovations for improving performance and reducing costs of...

Read More »
Test & Measurement

Automated Measurement System aids image sensor manufacturing.

Featuring seamless software integration with GEMINIÂ-® FB fusion wafer bonding system, EVGÂ-®40NT supports manufacture of 3D-integrated CMOS image sensors.Â- Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and...

Read More »
Adhesives & Sealants

Debonding Processes promote manufacturing flexibility.

LowTemp™ debonding platform featuresÂ- 3 room-temperature wafer debonding processes and extended material supply chain. TwoÂ- debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBONDÂ-® technology, which has been implemented into production...

Read More »
Machinery & Machining Tools

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind. - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly...

Read More »
Resist Processing System supports micro- and nano-electronics.
Machinery & Machining Tools

Resist Processing System supports micro- and nano-electronics.

Featuring robot with dual arms for accelerated wafer swapping, EVGÂ-®120 Automated Resist Processing SystemÂ- supports coating and developing applications forÂ- MEMSÂ- systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers...

Read More »
EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Electronic Components & Devices

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's GeminiÂ-® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

Read More »
Electronic Components & Devices

UV-NIL Step and Repeat System is designed for accuracy.

UV-nanoimprint lithography (UV-NIL) step and repeat system, EVG770 Gen II NIL Stepper, incorporates abilities that promote process reliability, accuracy, and pattern fidelity at decreasing feature densities. While vacuum imprinting on spun-on polymer layer eliminates defect issues caused by trapped air bubbles, optical sensors align stamp and wafer into perfect parallelism for contact-free wedge...

Read More »

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