EV Group, Inc.
Tempe, AZ 85284
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...
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Wafer Bonding Systems support wafers up to 200 mm in diameter.
Designed for universities and R&D groups, EVG-®580 ComBond-® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot...
Read More »
Nanoimprint Lithography Process aids photonic device production.
Available on NIL platforms, including mask aligners as well as EVG-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40...
Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Built to support high-volume manufacturing requirements, EVG-®580 ComBond-® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up to...
Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
GEMINI-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs),- incorporates SmartView-® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma).- Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer...
Read More »
Photoresist Processing System provides conformal coating.
Available on EVG150XT Resist Coating System for high-volume manufacturing semiconductor applications, NanoSpray provides conformal coating of structures that have vertical sidewall angles, such as through-silicon vias, through-glass vias, and through-substrate vias used for 2.5D interposers and 3D-ICs. NanoSpray can deposit polymer liners ranging from 1–20 microns thick, minimizing mechanical...
Read More »EV Group and Brisbane Materials Introduce Novel Anti-Reflective Coating Solution for LED Lighting Applications at Strategies in Light 2014
Unique anti-reflective materials combined with coating equipment and process expertise create 'total' AR coating solution to increase lumen output by up to eight percent SANTA CLARA, Calif. - STRATEGIES IN LIGHT- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar and semiconductor markets, and Brisbane Materials Technology (BMT), a...
Read More »
Photoresist Processing System suits high volume manufacturing.
Intended for high-volume logic and memory manufacturing, 300 mm EVG-®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process...
Read More »EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices
EVG-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, Austria- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon...
Read More »Lithography System offers soft template replication.
Providing full-field imprint lithography with integrated soft stamp/template fabrication capability, EVG-®720 Automated UV Nanoimprint Lithography System enables throughputs of more than 60 wafers/hr. System can print nanostructures as small as 40 nm in diameter over large area in volume production. Designed to work with wide variety of resist materials, EVG720 is suited for manufacturing...
Read More »
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...
Read More »
Wafer Bonding Systems support wafers up to 200 mm in diameter.
Designed for universities and R&D groups, EVG-®580 ComBond-® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot...
Read More »
Nanoimprint Lithography Process aids photonic device production.
Available on NIL platforms, including mask aligners as well as EVG-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40...
Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Built to support high-volume manufacturing requirements, EVG-®580 ComBond-® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up to...
Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
GEMINI-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs),- incorporates SmartView-® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma).- Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer...
Read More »
Photoresist Processing System provides conformal coating.
Available on EVG150XT Resist Coating System for high-volume manufacturing semiconductor applications, NanoSpray provides conformal coating of structures that have vertical sidewall angles, such as through-silicon vias, through-glass vias, and through-substrate vias used for 2.5D interposers and 3D-ICs. NanoSpray can deposit polymer liners ranging from 1–20 microns thick, minimizing mechanical...
Read More »EV Group and Brisbane Materials Introduce Novel Anti-Reflective Coating Solution for LED Lighting Applications at Strategies in Light 2014
Unique anti-reflective materials combined with coating equipment and process expertise create 'total' AR coating solution to increase lumen output by up to eight percent SANTA CLARA, Calif. - STRATEGIES IN LIGHT- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar and semiconductor markets, and Brisbane Materials Technology (BMT), a...
Read More »
Photoresist Processing System suits high volume manufacturing.
Intended for high-volume logic and memory manufacturing, 300 mm EVG-®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process...
Read More »EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices
EVG-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, Austria- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon...
Read More »Lithography System offers soft template replication.
Providing full-field imprint lithography with integrated soft stamp/template fabrication capability, EVG-®720 Automated UV Nanoimprint Lithography System enables throughputs of more than 60 wafers/hr. System can print nanostructures as small as 40 nm in diameter over large area in volume production. Designed to work with wide variety of resist materials, EVG720 is suited for manufacturing...
Read More »