Indian Institute of Technology, Bombay, Selects EV Group Systems for Micro-Fabricated Sensor Research and Development Project
ST. FLORIAN, Austria, Feb. 5 / -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. IIT Bombay purchased the EVG620TB bond and mask aligner and EVG501 wafer bonder for a new Indian government-supported automotive MEMS R&D project being pursued in close cooperation with the Indian Institute of Science, Bangalore, which previously purchased the same EVG equipment. The new EVG systems are slated for installation this month in IIT Bombay's Mumbai facility.
According to estimates by Phoenix-based market research and consulting firm Semiconductor Partners, the MEMS market will reach US$10 billion by 2011. Automotive MEMS represent the second largest segment within the overall MEMS market, after IT peripherals, with the number of MEMS devices per vehicle expected to increase by approximately one-third over the same period.
"We created the Centre of Excellence in Nanoelectronics at IIT Bombay for the specific purpose of conducting research in nano-scale devices and micro-fabricated sensors, and we are pleased to note that it is considered one of India's leading laboratories in this field," said Prof. V. Ramgopal Rao, Chief Investigator for the Nanoelectronics Centre Project, IIT Bombay. "We selected the EVG equipment for the Nanoelectronics Centre facility based on the strong recommendation of our partner organization in Bangalore. This synergy between the two institutes will facilitate our R&D activities, and help ensure the highest possible quality of results."
According to Herwig Kirchberger, EVG Business Development Manager, "The rapid rate of growth of India's technology infrastructure is driving demand for ongoing technology exploration and development. Partnering with this prestigious research institute provides EV Group with an exciting opportunity to leverage its technological leadership in the MEMS market to ensure that the region's efforts in this sector produce useful results that can ultimately be transferred to production-level automotive applications."
The EVG620TB performs precise wafer/substrate alignment with 1 micron alignment accuracy for wafer-bonding applications. It features a high-resolution, bottom-side split-field microscope and special capabilities to support MEMS processing requirements, including bond alignment for double and triple stacks, and universal align/bond chucks to transfer aligned wafers to wafer-bonding systems in the EVG500 family.
The EVG501 performs anodic, thermo-compression, fusion bonding or low-temperature plasma bonding via a single, universal bond chamber in which the top and bottom of the wafer are heated independently to compensate for different coefficients of thermal expansion. The system can support all MEMS wafer sizes and materials up to 150mm, with full support for fragile or bowed wafers, and is designed for ease of transfer from R&D to volume production.
About IIT Bombay
IIT Bombay was established in 1958, at Powai, a northern suburb of Mumbai. Today, the Institute is recognized as one of the centers of academic excellence in the country. IIT Bombay also places considerable emphasis on research and development work. The Institute plays a very significant role in diverse facets of R&D, keeping pace with the rapidly expanding frontiers of knowledge, national needs and global developments. Its pre-eminent position at the cutting edge of research is reflected in its impressive catalog of research projects, funded by national/international and government agencies and industries. More information can be found at http://www.iitb.ac.in/
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for chip packaging and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. The company's vertical infrastructure allows EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at http://www.evgroup.com/
Source: EV Group
CONTACT: Thomas Fodermeyer, Director Marketing and Communications of EV Group, + 43 7712 5311 0, Marketing@EVGroup.com; or Marie Labrie, Vice President of MCA, Inc., +1-650-968-8900, ext. 119, mlabrie@mcapr.com, for EV Group
Web site: http://www.evgroup.com/
http://www.iitb.ac.in/
