Manncorp
Huntingdon Valley, PA 19006
Reflow Oven suits mid-volume PCB assembly.
Equipped with 10 reinforced PID temperature controllers in each of 5 upper and lower chambers, Model R-500 precisely profiles critical solder paste reflow parameters. Three thermocouple inputs are provided for real-time monitoring of component and PCB temperatures. Computer-controlled oven is available with 16 in. stainless steel mesh belt or combination mesh belt and stainless steel adjustable...
Read More »MC 384 Pick & Place System
Apr 13 2007 The MC-384 pick & place system, offering the versatility and increased capacity to meet the challenges of today's surface mount prototyping and other short-to-medium run applications, will be showcased at the Autotronic Exhibit, 2L02 at Nepcon Shanghai, April 24-27. The system, distributed in North American by Manncorp of Willow Grove, PA and San Diego, CA, features Cognex®...
Read More »Low-Cost Manual SMD Rework System Replicates Ideal Processing Environments
Jun 1 2007 Manncorp has introduced a manually operated rework system capable of achieving the exact thermal and air flow conditions necessary for lead-free or regular processing of fine-pitch devices. The Martin Hot Jet 05 is used for desoldering, flux application, placement and soldering of chips, QFPs and BGA/CSPs. Although priced at under $5,000, the system's modules are fully compatible with...
Read More »Dual-Wave Solder System includes titatnium finger conveyor.
Pb-free MT-300 is available for low- to mid-volume PCB assemblers seeking defect-free soldering of high-density boards populated with through-hole, SMT, or mixed technology components. This 8 ft long system utilizes dual transducer-controlled motors for uniform wave heights and includes adjustable titanium finger conveyor with max board width of 11.75 in. Automatic finger cleaner is standard, as...
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Reflow Oven handles high-tech materials.
Model SMRO-0403C full convection, 16 in. reflow oven features 8 zones and is designed to handle 0201s, CSPs, BGAs, and lead free pastes. Unit is programmable through built-in control panel or via PC software. Thermocouples are included for real-time, dual-channel profiling.
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Flying Probe Tester screens low volume and short run assemblies.
AutoPoint II can be programmed via CAD conversion or teach-in. System probes, digitizes, and learns signatures of each component or node of given PCB so that subsequent boards can be tested and diagnosed entirely automatically.
Read More »Reflow Oven has flux management system and touch-screen.
SMT 1.7TC solders most paste at set temperature up to 40 deg C while consuming only 3 kW per hour. Slot nozzles are installed perpendicular to conveyor at top and bottom of oven's peak zone and act like curtain of hot air that boards must pass through. After heat is transferred to board, air is sucked back into channels beside nozzles for reheating. Short travel distance allows for fan capacity...
Read More »Assembly Station produces to IPC Class 3 specifications.
Expert FPSA-BGA semi-automatic assembly station has 2 heads and 2 vision systems, 1 with glass prism for fine pitch parts and 1 with split vision for ball grid array packages. After alignment has been achieved, automatic mounting of component guarantees exact placements. Reality-based graphics allow operator to double-check placement programming prior to assembly. Program sequence is shown...
Read More »Rework Station mimics original reflow conditions.
M-8000 removes and remounts wide range of components, and produces assemblies that equal those produced in original assembly. It includes pad cleaning, dispensing, and soldering/desoldering tools; nozzles needed to work with any IC, PLCC or QFP; tools for BGAs and CSPs; and fast-on/fast-off IR underheater to prevent board warp. Included SolderStar software features expandable component library...
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