NDT International Inc

Test Instrument detects bond flaws.
Sensors, Monitors & Transducers

Test Instrument detects bond flaws.

Bondetector(TM) provides C-Scan image of bond flaws in composite parts and honeycomb structure elements for aircraft, aerospace, automotive, appliance, and other manufacturers. Imaging/data acquisition feature allows for immediate visualization and interpretation of flawed areas. Bi-directional RS-232 communications port enables inspection results to be printed or transmitted to external PC.

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Test Instrument detects bond flaws.
Sensors, Monitors & Transducers

Test Instrument detects bond flaws.

Bondetector(TM) provides C-Scan image of bond flaws in composite parts and honeycomb structure elements for aircraft, aerospace, automotive, appliance, and other manufacturers. Imaging/data acquisition feature allows for immediate visualization and interpretation of flawed areas. Bi-directional RS-232 communications port enables inspection results to be printed or transmitted to external PC.

Read More »

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