Solid State Equipment LLC
Horsham, PA 19044
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SSEC Wet Processors SEMI-® S2-0703aE Certified
Horsham, PA- Solid State Equipment Corporation announces that its SSEC 3300 family of single wafer wet cleaners and processors has been certified through a third party for safety compliance with SEMIÃ-® S2-0703aE. This certification confirms SSEC's commitment to producing safe and easy-to-use systems, and follows previous certifications for SEMI S2-0200, S2-98, and S2-93. SSEC processors are...
Read More »Wafer Processor achieves throughputs up to 180 wafers/hr.
Single wafer wet processor, Model SSEC 3308, can be optimized for parallel processing or complex serial recipes. Eight process modules may be configured in any combination of application-specific double-sided clean, wet etch, or strip processing configurations. Wafers can be handled cassette-to-cassette, or in 300 mm FOUPs or 200 mm SMIF pods. All mechanisms are fully sealed for Class 1...
Read More »SSEC Wet Processors SEMI-® S2-0703aE Certified
Horsham, PA- Solid State Equipment Corporation announces that its SSEC 3300 family of single wafer wet cleaners and processors has been certified through a third party for safety compliance with SEMIÃ-® S2-0703aE. This certification confirms SSEC's commitment to producing safe and easy-to-use systems, and follows previous certifications for SEMI S2-0200, S2-98, and S2-93. SSEC processors are...
Read More »SSEC Announces New Director of Process Engineering
In its continuing commitment to helping customers meet their processing goals, Solid State Equipment Corporation has appointed Vinh Thanh Nguyen Director of Process Engineering. Nguyen will be responsible for providing expertise and support to customers utilizing SSEC application technologies. This level of support is expected to improve and optimize customers' processes for the best results and...
Read More »Wafer Processor achieves throughputs up to 180 wafers/hr.
Single wafer wet processor, Model SSEC 3308, can be optimized for parallel processing or complex serial recipes. Eight process modules may be configured in any combination of application-specific double-sided clean, wet etch, or strip processing configurations. Wafers can be handled cassette-to-cassette, or in 300 mm FOUPs or 200 mm SMIF pods. All mechanisms are fully sealed for Class 1...
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