Andon Electronics Corp.
Lincoln, RI 02865
Test Socket eliminates co-planarity problems.
BGA test socket has guided contact plunger that makes contact on periphery of solder ball, and maintains perpendicularity. Tapered cup design makes contact on angle and does not touch spherical radius of solder ball on bottom. Device features Rollerball(R) SMT technology and is available with solder tails for through-hole mounting. It is also available in 1.27, 1, 0.8, and 0.75 mm pitches.
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Test Socket eliminates co-planarity problems.
BGA test socket has guided contact plunger that makes contact on periphery of solder ball, and maintains perpendicularity. Tapered cup design makes contact on angle and does not touch spherical radius of solder ball on bottom. Device features Rollerball(R) SMT technology and is available with solder tails for through-hole mounting. It is also available in 1.27, 1, 0.8, and 0.75 mm pitches.
Read More »