Test Socket eliminates co-planarity problems.
Press Release Summary:
BGA test socket has guided contact plunger that makes contact on periphery of solder ball, and maintains perpendicularity. Tapered cup design makes contact on angle and does not touch spherical radius of solder ball on bottom. Device features Rollerball(R) SMT technology and is available with solder tails for through-hole mounting. It is also available in 1.27, 1, 0.8, and 0.75 mm pitches.Original Press Release:
New Patent Pending BGA Test Socket from Andon Electronics Eliminates Co-Planarity Problems and Offers More Reliable Contact and Continuity, and Longer Life
LINCOLN, RI-Andon Electronics Corporation announces the introduction of a new line of BGA and LGA test sockets that solve many of the problems inherent in conventional designs. Andon's new socket features a guided contact plunger that makes a high reliability contact on the periphery of the solder ball, and maintains perpendicularity. It also features a tapered cup design that makes contact on an angle and does not touch the spherical radius of the solder ball on the bottom which would normally be the contacting point on the PCB pad.
The spring pushing the plunger never makes contact with the BGA device, unlike conventional designs where the sharp end of the spring makes contact and often deforms the solder ball, disrupting its coplanarity. The plunger is guided at the top and bottom of the terminal and provides a direct current path from the solder ball to the PCB, providing long service life as well as superior electrical contact and continuity, unlike conventional designs where electrical contact is only made through the spring.
Andon's new test socket features a full-length contact plunger and spring that provides a uniform stroke without fatigue. It also has been designed to provide sufficient force on the solder ball cup to penetrate oxides without deforming the ball. Land Grid Array (LGA) has a spear shape to penetrate a smaller surface area that may have reworked solder for reballing.
The new device features Andon's patented Rollerball® SMT technology and is also available with solder tails for through-hole mounting. It is also available in 1.27mm, 1mm, 0.8mm and 0.75mm pitches with a price base of $0.50 to $0.90 per pin depending on quantities.
Andon is an industry leader having pioneered the development of BGA sockets, adaptors and several major innovations in interconnection technology. Today, Andon offers more than 2,000 different High-Rel interconnection products as well as custom-
engineered products. For more information, contact Andon Electronics Corporation, 4 Court Drive, Lincoln, RI 02865; Tel: 401-333-0388; Fax: 401-333-0287; email: info@andonelect.com. Visit our web site at: www.andonelect.com
