Company News

Nordson March

2470-A Bates Ave., Concord, CA, 94520, USA

  • 800-326-1151

Latest New Product News from
Nordson March

RollVIA™ Plasma Processing System features gas flow technology.

Nov 30, 2017

RollVIA™ Plasma Processing System is suitable for printed circuit board manufacturing. Unit is used for surface activation, carbon removal, descum/desmear and etchback. Product comes in 1737 x 2020 x 2323 mm footprint and comes with 40 kHz power supply which is housed in a single enclosure. System allows user to process web widths from 48 to 600 mm and is configurable with 1, 3, or 5 plasma... Read More

Machinery & Machining Tools, Material Handling & Storage

PD Series Plasma Deposition Systems eliminate wet chemistry.

Feb 09, 2017

Using plasma polymerization, Plasma Deposition Systems deposit thin films uniformly during precision manufacturing. PDS makes surfaces resistant to corrosion by making it more slippery. PD-1000 and PD-1500 are used for batch prototype and production processing of substrates, PD-Pro has large plasma processing cavity for treating big substrates. Products are used for pinhole-free coating of 100... Read More

Machinery & Machining Tools, Material Handling & Storage, Mounting & Attaching Products

Plasma Confinement Ring accelerates etch rate.

Sep 23, 2016

Available with SPHERE™ plasma systems, Plasma Confinement Ring targets wafer processing and wafer fan-out applications. Made with insulated, non-conductive material, ring concentrates and focuses plasma directly over wafer to speed etching process, provide uniform plasma coverage, and to isolate plasma on wafer itself. Using confinement ring, there is a free conduction path between upper and... Read More

Machinery & Machining Tools

Plasma System expands from 4 to 8 cells to increase capacity.

May 09, 2016

Along with 65 x 69 x 97 in. chamber and 4–8 cell (8–16 panel) capacity, ModVIA™ provides technology to treat PCBs for desmear and etchback as well as provide surface activation. Integrated system accommodates diverse PCB panel technologies in various shapes and sizes, including rigid, flexible, through-hole, and blind via, and works with range of process gases: such as Ar, O2, N2, and... Read More

Machinery & Machining Tools

Plasma Treatment Systems expand up to 6 chambers.

Aug 25, 2015

Configurable with 2, 4, or 6 chambers, StratoSPHERE™ Series is intended for wafer-level packaging and 3D packaging applications. Systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations. Designed to handle semiconductor wafers up to 12 in. in diameter, systems... Read More

Machinery & Machining Tools, Material Handling & Storage

Plasma Treatment Systems serve semiconductor applications.

Jul 07, 2015

Targeting wafer-level and 3D packaging applications, TrophoSPHERE™ and StratoSPHERE™ support automated handling and processing of round or square wafers and perform descum, ashing, dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Troposphere is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes from 3–8 in.... Read More

Machinery & Machining Tools

Plasma System suits semiconductor and electronics packaging.

Sep 03, 2014

Equipped with 5.5 liter plasma chamber, FlexTRAK-S™ supports variable-size form factors including boats, carriers, Jedec/Auer® boats, strips, and laminates. System can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as standalone for island-based production environments. Offering direct, downstream, and ion-free plasma... Read More

Machinery & Machining Tools

Plasma Treatment System processes flexible electronic substrates.

Jun 06, 2014

FlexVIA-Plus™ delivers single-stage plasma processing, including etchback, desmear, and descum capabilities, for up to 30, 20 x 32 in. panels per cycle. Achieving rate of as much as 200 units/hr for manufacture of flexible electronic PCBs and substrates, system features horizontal electrode design with integrated rack that optimizes material alignment for plasma treatment uniformity.... Read More

Cleaning Products & Equipment, Machinery & Machining Tools

Plasma Treatment System supports circuit board fabrication.

Apr 29, 2014

Providing 15-cell chamber in 1.7 x 1.7 m footprint, MaxVIA-Plus™ treats HDI, flexible, and rigid panels for desmear, etchback, and landing pad cleaning operations. PCBs are vertically loaded using easy-loading cart, which minimizes idle time. With unique vacuum and gas flow technology, optimized electrode designs, and temperature management, plasma system delivers highly uniform PCB treatment. Read More

Machinery & Machining Tools

Plasma Treatment System handles strip-type electronic components.

Apr 09, 2014

Designed for plasma treatment prior to die attach, wire bond, mold encapsulation, and underfill, FlexTRAK-CDS™Â removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing. Plasma chamber treats up to 10 strips per plasma cycle, and integrated handling system accommodates range of strip sizes. Processing can be done from most... Read More

Machinery & Machining Tools, Material Handling & Storage

Self-Contained Vacuum Plasma System treats flex PCB materials.

Sep 13, 2012

Featuring dual-rack chamber that accommodates up to eighteen 20 x 24 in. panels in one cycle, FlexVIA™ Plasma System treats inner surface layer of flexible PCB prior to lamination for maximum adhesion and reliability. Both sides of flex material surface area are treated in one-step process, enabling rate of 80–120 units per hour. Negating need for temperature control, blower, or... Read More

Machinery & Machining Tools

Plasma Treatment System handles 92-138 units/hour.

Jun 21, 2011

By treating variety of panel sizes and types, MaxVIA(TM) streamlines printed circuit board manufacturing process. System provides optimal uniformity in desmear and etchback applications for high density interconnect, flexible, and rigid circuit board manufacturing. Equipped with expanded plasma chamber, MaxVIA(TM) accommodates large panel sizes up to 24 x 42 in. Read More

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Nordson March