Nordson Electronics Solutions, MARCH Products
Carlsbad, CA 92010
Nordson MARCH Receives NPI Award for Its RollVIA Self-Contained Vacuum Plasma System
Facilitates Flexible Circuit Board Manufacturing Concord, California, USA - 06 March 2018 - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as...
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MesoSPHERE™ Plasma System features pocket chuck design.
MesoSPHERE™ Plasma System is suitable for 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. Unit comes with W3 three-axis symmetrical plasma chamber. System descums wafers of residual photoresist and BCB, pattern dielectric layers in wafer etching applications whereas in wafer cleaning applications...
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RollVIA™ Plasma Processing System features gas flow technology.
RollVIA™ Plasma Processing System is suitable for printed circuit board manufacturing. Unit is used for surface activation, carbon removal, descum/desmear and etchback. Product comes in 1737 x 2020 x 2323 mm footprint and comes with 40 kHz power supply which is housed in a single enclosure. System allows user to process web widths from 48 to 600 mm and is configurable with 1, 3, or 5 plasma...
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Nordson MARCH Wins 2017 New Product Introduction Award for its ModVIA Plasma System
System doubles capacity for production demands Concord, California, USA - 7 March 2017 - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, has won the 2017 New Product Introduction (NPI) Award in the Surface Treatment Equipment category for its ModVIA™ Plasma Treatment System. The Award, sponsored by Printed Circuit Design and Fab magazine, was...
Read More »
PD Series Plasma Deposition Systems eliminate wet chemistry.
Using plasma polymerization, Plasma Deposition Systems deposit thin films uniformly during precision manufacturing. PDS makes surfaces resistant to corrosion by making it more slippery. PD-1000 and PD-1500 are used for batch prototype and production processing of substrates, PD-Pro has large plasma processing cavity for treating big substrates. Products are used for pinhole-free coating of 100 pm...
Read More »
Nordson MARCH Receives Global Technology Award for FlexTRAK-CDS High-volume Plasma System
System delivers industry-leading throughput capacity with short cycle times Joe Stockunas, vice president, Advanced Technology, Nordson Corporation, accepts award Concord, California, USA - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma cleaning technology, received the 2016 Global Technology Award for its FlexTRAK-®-CDS high-volume plasma system at a ceremony held in...
Read More »
Plasma System expands from 4 to 8 cells to increase capacity.
Along with- 65 x 69 x 97 in. chamber and 4–8 cell (8–16 panel) capacity, ModVIA™ provides technology to treat PCBs for desmear and etchback as well as provide surface activation. Integrated system accommodates diverse PCB panel technologies in various shapes and sizes, including rigid, flexible, through-hole, and blind via, and works with- range of process gases: such as Ar, O2, N2, and...
Read More »
Plasma Treatment Systems expand up to 6 chambers.
Configurable with 2, 4, or 6 chambers, StratoSPHERE™ Series is intended for wafer-level packaging and 3D packaging applications. Systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations. Designed to handle semiconductor wafers up to 12 in. in diameter, systems...
Read More »
Plasma Treatment Systems serve semiconductor applications.
Targeting wafer-level and 3D packaging applications, TrophoSPHERE™ and StratoSPHERE™ support automated handling and processing of round or square wafers and perform descum, ashing, dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Troposphere is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes from 3–8 in....
Read More »Nordson MARCH Wins 2015 NPI Award for Its FlexVIA-Plus Plasma Treatment System
System provides desmear and etchback plasma treatment of flexible electronic substrates with capacity of up to 30 panels per cycle Jonathan Doan, Nordson MARCH, accepts award from Mike Buetow, editor Circuits Assembly Concord, California, USA - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, has won the 2015 New Product Introduction (NPI) Award in...
Read More »
Nordson MARCH Receives NPI Award for Its RollVIA Self-Contained Vacuum Plasma System
Facilitates Flexible Circuit Board Manufacturing Concord, California, USA - 06 March 2018 - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as...
Read More »
MesoSPHERE™ Plasma System features pocket chuck design.
MesoSPHERE™ Plasma System is suitable for 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. Unit comes with W3 three-axis symmetrical plasma chamber. System descums wafers of residual photoresist and BCB, pattern dielectric layers in wafer etching applications whereas in wafer cleaning applications...
Read More »
RollVIA™ Plasma Processing System features gas flow technology.
RollVIA™ Plasma Processing System is suitable for printed circuit board manufacturing. Unit is used for surface activation, carbon removal, descum/desmear and etchback. Product comes in 1737 x 2020 x 2323 mm footprint and comes with 40 kHz power supply which is housed in a single enclosure. System allows user to process web widths from 48 to 600 mm and is configurable with 1, 3, or 5 plasma...
Read More »
Nordson MARCH Wins 2017 New Product Introduction Award for its ModVIA Plasma System
System doubles capacity for production demands Concord, California, USA - 7 March 2017 - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, has won the 2017 New Product Introduction (NPI) Award in the Surface Treatment Equipment category for its ModVIA™ Plasma Treatment System. The Award, sponsored by Printed Circuit Design and Fab magazine, was...
Read More »
PD Series Plasma Deposition Systems eliminate wet chemistry.
Using plasma polymerization, Plasma Deposition Systems deposit thin films uniformly during precision manufacturing. PDS makes surfaces resistant to corrosion by making it more slippery. PD-1000 and PD-1500 are used for batch prototype and production processing of substrates, PD-Pro has large plasma processing cavity for treating big substrates. Products are used for pinhole-free coating of 100 pm...
Read More »
Nordson MARCH Receives Global Technology Award for FlexTRAK-CDS High-volume Plasma System
System delivers industry-leading throughput capacity with short cycle times Joe Stockunas, vice president, Advanced Technology, Nordson Corporation, accepts award Concord, California, USA - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma cleaning technology, received the 2016 Global Technology Award for its FlexTRAK-®-CDS high-volume plasma system at a ceremony held in...
Read More »
Plasma System expands from 4 to 8 cells to increase capacity.
Along with- 65 x 69 x 97 in. chamber and 4–8 cell (8–16 panel) capacity, ModVIA™ provides technology to treat PCBs for desmear and etchback as well as provide surface activation. Integrated system accommodates diverse PCB panel technologies in various shapes and sizes, including rigid, flexible, through-hole, and blind via, and works with- range of process gases: such as Ar, O2, N2, and...
Read More »
Plasma Treatment Systems expand up to 6 chambers.
Configurable with 2, 4, or 6 chambers, StratoSPHERE™ Series is intended for wafer-level packaging and 3D packaging applications. Systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations. Designed to handle semiconductor wafers up to 12 in. in diameter, systems...
Read More »
Plasma Treatment Systems serve semiconductor applications.
Targeting wafer-level and 3D packaging applications, TrophoSPHERE™ and StratoSPHERE™ support automated handling and processing of round or square wafers and perform descum, ashing, dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Troposphere is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes from 3–8 in....
Read More »Nordson MARCH Wins 2015 NPI Award for Its FlexVIA-Plus Plasma Treatment System
System provides desmear and etchback plasma treatment of flexible electronic substrates with capacity of up to 30 panels per cycle Jonathan Doan, Nordson MARCH, accepts award from Mike Buetow, editor Circuits Assembly Concord, California, USA - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, has won the 2015 New Product Introduction (NPI) Award in...
Read More »