Flipchip International LLC

Electronic Components & Devices

FlipChip International and Fujikura Ltd. Announce Strategic Business Agreement for ChipletT and ChipsetT Fan-out and Fan-in 3D Semiconductor Packages

PHOENIX - FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced conclusion of a Joint Strategic Sales and Business Development Agreement. This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT(TM) and ChipsetT(TM) ultra low...

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Electronic Components & Devices

FlipChip International and Fujikura Ltd. Announce ChipletT(TM)/ ChipsetT(TM) Ultra Thin 3D Packages

PHOENIX, -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology WABE Technology(TM)" and will provide breakthrough...

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Packaging Products & Equipment

RoseStreet Labs Scientists Demonstrate First Long Wavelength LED Based on InGaN on Silicon Technology

PHOENIX - RoseStreet Labs, (RSL), announced today the world's first demonstration of a long wavelength LED device utilizing low cost silicon wafer substrates. Green and longer wavelength LEDs have been sought after by both science and industry for an extensive period of time because they would fill a high-value gap in the rapidly growing global LED market for lighting and illumination where...

Read More »
Electronic Components & Devices

FlipChip International Announces Enhanced Lead Free (ELF(TM)) Technology for Major Improvements in WLCSP Drop Test Performance

PHOENIX, Oct. 6 // -- FlipChip International LLC announced today that it has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP) products utilizing a new lead-free technology called Enhanced Lead Free(TM) (ELF(TM)). This major achievement was first realized in FCI's Advanced Reliability...

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Electronic Components & Devices

Flip Chip is designed for wafer bumping applications.

EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...

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Mergers & Acquisitions

Tianshui Huatian Technology Company Ltd Announce the Acquisition of FlipChip International LLC

PHOENIX –Â- Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 1, 2015. TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components, and is growing fast on the international stage. The acquisition of FCI, the global technology leader in Flip Chip bumping and...

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Electronic Components & Devices

FlipChip International and Fujikura Ltd. Announce Strategic Business Agreement for ChipletT and ChipsetT Fan-out and Fan-in 3D Semiconductor Packages

PHOENIX - FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced conclusion of a Joint Strategic Sales and Business Development Agreement. This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT(TM) and ChipsetT(TM) ultra low...

Read More »
Electronic Components & Devices

FlipChip International and Fujikura Ltd. Announce ChipletT(TM)/ ChipsetT(TM) Ultra Thin 3D Packages

PHOENIX, -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology WABE Technology(TM)" and will provide breakthrough...

Read More »
Packaging Products & Equipment

RoseStreet Labs Scientists Demonstrate First Long Wavelength LED Based on InGaN on Silicon Technology

PHOENIX - RoseStreet Labs, (RSL), announced today the world's first demonstration of a long wavelength LED device utilizing low cost silicon wafer substrates. Green and longer wavelength LEDs have been sought after by both science and industry for an extensive period of time because they would fill a high-value gap in the rapidly growing global LED market for lighting and illumination where...

Read More »
Electronic Components & Devices

FlipChip International Announces Enhanced Lead Free (ELF(TM)) Technology for Major Improvements in WLCSP Drop Test Performance

PHOENIX, Oct. 6 // -- FlipChip International LLC announced today that it has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP) products utilizing a new lead-free technology called Enhanced Lead Free(TM) (ELF(TM)). This major achievement was first realized in FCI's Advanced Reliability...

Read More »
Electronic Components & Devices

Flip Chip is designed for wafer bumping applications.

EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...

Read More »

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