Flipchip International LLC
Phoenix, AZ 85034
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FlipChip International Announces Enhanced Lead Free (ELF(TM)) Technology for Major Improvements in WLCSP Drop Test Performance
PHOENIX, Oct. 6 // -- FlipChip International LLC announced today that it has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP) products utilizing a new lead-free technology called Enhanced Lead Free(TM) (ELF(TM)). This major achievement was first realized in FCI's Advanced Reliability...
Read More »Flip Chip is designed for wafer bumping applications.
EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...
Read More »Tianshui Huatian Technology Company Ltd Announce the Acquisition of FlipChip International LLC
PHOENIX –Ã- Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 1, 2015. TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components, and is growing fast on the international stage. The acquisition of FCI, the global technology leader in Flip Chip bumping and...
Read More »FlipChip International Announces Enhanced Lead Free (ELF(TM)) Technology for Major Improvements in WLCSP Drop Test Performance
PHOENIX, Oct. 6 // -- FlipChip International LLC announced today that it has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP) products utilizing a new lead-free technology called Enhanced Lead Free(TM) (ELF(TM)). This major achievement was first realized in FCI's Advanced Reliability...
Read More »Flip Chip is designed for wafer bumping applications.
EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...
Read More »