Coherent, Inc.

Laser Beam Profiling Cameras cover UV and IR spectral range.
Controls & Controllers

Laser Beam Profiling Cameras cover UV and IR spectral range.

Operating over 190-355 nm spectral range, LaserCam-HR-UV records beam characteristics at third (355 nm), fourth (266 nm), and fifth (213 nm) harmonics of Nd:YAG lasers, as well as output of most excimer lasers. LaserCam-HR-InGaAs measures infrared laser beams from 900-1,700 nm, and is compatible with eye safe military lasers, telecom sources, and Nd:YAG fundamental. Both units are powered through...

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Diode-pumped Laser suits silicon micromachining applications.
Electronic Components & Devices

Diode-pumped Laser suits silicon micromachining applications.

AVIA(TM) 532-45 diode-pumped, solid state laser provides 45 W of average power at 532 Nm in single mode output beam (M2 less than 1.3). PulseEQ(TM) feature delivers constant pulse energy over time, even with varying repetition rates, while ThermEQ(TM) ensures uniform pulse energy when operated in burst mode. Applications include singulation of QFN, FBGA, Â-µSD (MMC), and direct chip attach...

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Laser Energy Sensor measures pulses as low as 100 nJ.
Sensors, Monitors & Transducers

Laser Energy Sensor measures pulses as low as 100 nJ.

With ability to operate at repetition rates of 10 kHz, J-10MT-10KHZ laser energy sensor delivers single-pulse noise equivalent energy level of 10 nJ on 100 nJ pulses, without averaging. It utilizes diffuse metallic coating, which incorporates automatic spectral compensation over 193-2,100 nm. Plug and play compatible 10 mm dia sensor features 3 m long molded cable with bend and strain relief,...

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OEM Ultraviolet Laser is optimized for low beam divergence.
Electronic Components & Devices

OEM Ultraviolet Laser is optimized for low beam divergence.

Frequency-tripled DPSS (diode pumped solid state) laser, MATRIX(TM) 355 BE, integrates beam expander within sealed laser head, resulting in output beam diameter of 2.2 mm and divergence of 0.5 mrad. RoHS-compliant product is offered with 1 or 2 W average power and pulse repetition rates up to 60 kHz. It suits precision applications in materials processing and marking, such as stereolithography,...

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Electronic Components & Devices

UV Laser handles high-throughput micromachining applications.

Delivering 28 W of output at 355 nm, AVIA(TM) 355-28 is targeted at micromachining applications in semiconductor fabrication and packaging as well as solar cell production. It features PosiLock(TM) technology for achieving repeatable spot positioning at work surface, and PulseEQ(TM), which provides constant pulse energy across wide range of rapidly varying pulse repetition rates. Unit also...

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Diode Laser System is microprocessor controlled.
Electronic Components & Devices

Diode Laser System is microprocessor controlled.

Fully integrated HB-Diode System delivers 75 W of power at either 808 nm from 200 Â-µm core 0.22 NA (numerical aperture) fiber, or 976 nm from 400 µm core 0.22 NA fiber. It operates from 110/220 Vac, and enables user control of diode output through either front panel keypad or electronic interface, including analog, TTL, RS-232, and RS-485. Suited for range of applications, unit also...

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Excimer Laser suits precision manufacturing and inspection.
Electronic Components & Devices

Excimer Laser suits precision manufacturing and inspection.

IndyStar(TM) industrial excimer laser produces stabilized energies of 8 mJ/pulse at 193 nm and 12 mJ at 248 nm operation at repetition rates up to 1 kHz with small beam cross-section (6 x 3 mm). It incorporates RoHS-Almeta tube technology, in which arrangement of electrode capacitors lowers charge density at electrodes without reducing output power, optimizing tube life. Laser can be used in...

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Fiber-Based Laser is suited for micromachining applications.
Electronic Components & Devices

Fiber-Based Laser is suited for micromachining applications.

With over 18 W of average power at pulse repetition rate of 200 kHz (pulsewidth of less than 15 ps), Talisker mode-locked laser enables precision micromachining at high throughput rates with negligible HAZ. Unit can be used on virtually any material type, including metals, polymers, glass, and semiconductors with choice of IR (1,064 nm), visible (532 nm), or UV (355 nm) output. It combines...

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Diode Laser Modules offer high brightness.
Electronic Components & Devices

Diode Laser Modules offer high brightness.

Utilizing AAA(TM) aluminum-free active area technology, FAP 200 delivers greater than 50 W at 976 nm or greater than 30 W at 808 nm from 200 Â-µm core diameter fiber with numerical aperture of 0.22. FAP 400 provides greater than 40 W at 880 nm or greater than 45 W at 808 nm from 400 µm core diameter fiber with 0.22 NA. Both fiber-coupled diode laser arrays are suitable for materials...

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UV Laser enables high speed IC die singulation.
Electronic Components & Devices

UV Laser enables high speed IC die singulation.

Suited for micromachining applications such as scribing low-semiconductors, dicing thin memory chips, and via hole drilling in PCBs, AVIA 355-23-250 delivers 8 W of 355 nm output at repetition rates of 250 kHz. Q-switched ultraviolet laser can also be operated at lower repetition rates, with pulse energies as high as 80 J. It features M2 < 1.3 beam quality , high pulse to pulse energy stability...

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