Kulicke & Soffa Industries Inc.
Fort Washington, PA 19034
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Hub Blades offer solution for dicing low-k wafers.
Nova(TM) Hub Blades incorporate formulations of diamond concentration and nickel bond to reduce chipping and peeling common in low-k wafer dicing. High yields are achieved even while advancing wafers through process at standard production feed rates. Product offered in different formulations to address requirements of various low-k wafer materials.
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Capillary bonds thicker wires in fine pitch uses.
CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 -µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and...
Read More »
Hub Blades offer solution for dicing low-k wafers.
Nova(TM) Hub Blades incorporate formulations of diamond concentration and nickel bond to reduce chipping and peeling common in low-k wafer dicing. High yields are achieved even while advancing wafers through process at standard production feed rates. Product offered in different formulations to address requirements of various low-k wafer materials.
Read More »
Capillary bonds thicker wires in fine pitch uses.
CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 -µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and...
Read More »