Kulicke & Soffa Industries Inc.

Capillary bonds thicker wires in fine pitch uses.
Adhesives & Sealants

Capillary bonds thicker wires in fine pitch uses.

CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and...

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Capillary bonds thicker wires in fine pitch uses.
Adhesives & Sealants

Capillary bonds thicker wires in fine pitch uses.

CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and...

Read More »

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