Advantest America Corp.
Santa Clara, CA 95054
Mar 09, 2006 Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8, 1, and 1.27 mm pitches.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 15, 2005 Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80 mm pitches and larger.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 01, 2005 Test and Burn-In Socket accommodates devices from 41-55 mm² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as CSP, MicroBGA, LCC, LGA, QFP, QFN, and MLF packages.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Dec 15, 2004 Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for SRAM and DRAM packages.

Magtrol, Inc.
Buffalo, NY 14224-1322
Mar 12, 2004 Adjustable Motor Fixture locates and holds motor in place for running any test, while maintaining center height required for coupling to company's HD-106 through HD-715 Hysteresis Short Base Plate Dynamometer. Lead screw adjustment provides centering for motor while T-Slot Base supplies multiple position options for various motor lengths. Adjustable bridge provides clamping anywhere along axis of motor and thumbscrew protects against vibration.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Oct 16, 2003 RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Operating temperature is -67 to 302°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 26, 2003 Designed for use with devices from 14-27 mm², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302°F. Based on device with 0.50 mm pitch, pin inductance is 0.75 nH Max, mutual inductance is less than 0.15 nH, and mutual capacitance is 0.03 pF max.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 09, 2003 RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80+ mm pitches.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 18, 2003 Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over 500,000 and can handle up to 2 A continuous current.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 14, 2003 Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact for 0.80 mm pitches and larger. Socket operating temperature is -67 to 302°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 10, 2003 Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194°F, with max differential temperature of 158°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 14, 2002 Integra 27 has molded PPS plastic components designed to minimize space without sacrificing repeatability and durability. Device-specific spring probe insert can be machined to match testing needs. Socket's contacts are IDI spring probes, some which are electrically characterized to 10 GHz. Contacts are durable enough to handle burn-in and HAST testing. User replaceable contacts have current capacity of 3-6 A per and durability of 500,000 actuations.

Synergetix
Kansas City, KS 66106
Jun 26, 2002 Integra 27 has molded frame with custom-designed interposer insert and integral clamshell lid. Insert is loaded with spring-contact probes that offer insertion life of 500,000 cycles, inductance as low as 0.33 nH, and bandwidths well over 10 GHz. Socket is made of PPS with beryllium copper or nickel silver contacts. Temperature rating is -55 to +150°C.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 28, 2002 High frequency test socket has replaceable spring probe interposer, which enables users to accommodate two separate interposers with same base socket. Features include solderless, single-ended spring probes; four locating posts; and hinged lid, double-latched lid, or CAM-style lid options. Pitches are available from 0.5 to 0.8 mm, signal path lengths are 0.095 in., and contact resistance is less than 60 milliohms after 500,000 life cycles.

Andon Electronics Corp
Lincoln, RI 02865
May 20, 2002 BGA test socket has guided contact plunger that makes contact on periphery of solder ball, and maintains perpendicularity. Tapered cup design makes contact on angle and does not touch spherical radius of solder ball on bottom. Device features Rollerball(R) SMT technology and is available with solder tails for through-hole mounting. It is also available in 1.27, 1, 0.8, and 0.75 mm pitches.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 08, 2002 Interposer socket provides signal paths from 0.008 to 0.015 in. Able to work above 10 GHz, Interposer's contact system has dielectric material with etched pads on top and bottom. Socket offers pressure mount plunge-to-board interposer and pitches down to 0.3 mm. Contacts have self-inductance of 0.1 nH and resistance of less than 20 milliohms. Required contact force is 15 and 28 g (minimum) per contact for manual and automated applications, respectively.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 17, 2002 DIP Test Sockets, for 350°C and 500°C applications, have high temperature ceramic body and high conductivity stainless steel contacts. Normally closed contacts provide twin beam wiping action. They are plated with 50µ in. gold over 50µ in. nickel. Sockets accept .300 in. center to .600 in. center row-row devices, up to 28 positions with leads on .100 in. pitch. They are offered in through-hole or surface mount versions.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Dec 05, 2001 Spring-loaded lids on radio frequency (RF) test sockets provide consistent lead pressure. Precise pressure requirements can be met with mix-and-match springs from 1/2 to 25 lbs. Each socket comes with floating leadbacker built into every lid, and lids can be used throughout RF/microwave, automated handling and burn-in/life testing applications. Each socket has Microstrip Contacts, which can be used for any pitch device up to 208 leads.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Nov 28, 2001 RF high-frequency CSP/BGA test sockets have spring probe contacts that provide 500,000+ insertion/withdrawal cycles with no loss of contact force or increase in contact resistance. Sockets offer short signal paths of 0.098 in. for 1.00 mm and 1.27 mm pitch packages. Self-inductance of sockets is 0.62 nH and contact resistance is 30m Ohms after 500,000 cycles. Propagation delay is 45 psec and capacitance is 0.45 pF.