Quantcast
 
Search for: Search what?
Oct 15, 2008  
 Newsletters
Subscribe Free to Product News Alerts
  
Receive customized, daily news on the products you want.
Subscribe   View Sample
 Categories
Industrial Market Trends
OnSite WebReviews
Latest New Product News
Adhesives and Sealants
Agricultural and Farming Products
Architectural and Civil Engineering Products
Automatic ID
Chemical Processing and Waste Management
Cleaning Products and Equipment
Communication Systems and Equipment
Computer Hardware and Peripherals
Construction Equipment and Supplies
Controls and Controllers
Display and Presentation Equipment
Electrical Equipment and Systems
Electronic Components and Devices
Explosives, Armaments and Weaponry
Fasteners and Hardware
Fluid and Gas Flow Equipment
Food Processing and Preparation
Health, Medical and Dental Supplies and Equipment
HVAC
Labels, Tags, Signage and Equipment
Laboratory and Research Supplies and Equipment
Lubricants
Machinery and Machining Tools
Material Handling and Storage
Materials and Material Processing
Mechanical Components and Assemblies
Mechanical Power Transmission
Mining, Oil Drilling & Refining
Mounting and Attaching Products
Non-Industrial Products
Optics and Photonics
Packaging Products & Equipment
Paints and Coatings
Plant Furnishings and Accessories
Portable Tools
Printing and Duplicating Equipment
Retail and Sales Equipment
Robotics
Safety and Security Equipment
Sensors, Monitors and Transducers
Services
Software
Test and Measuring Instruments
Textile Industry Products
Thermal and Heating Equipment
Timers and Clocks
Transportation Industry Products
Vision Systems
Waste Handling Equipment
Welding Equipment and Supplies
Association News
Browse Categories
Browse Companies
 Press Releases
Products in the News
Company News
Mergers & Acquisitions
People in the News
Literature & Websites
 Resources
News Delivery Options
Mobile Edition
PR Resources
Licensing
Advertising
How to Write an effective Press Release
Trade Associations
Small Business Support
MEP

Advertisement
Test & Measuring Instruments -> Test & Measurement Accessories -> Test Fixtures


Test Fixtures


   Add to Google      PDF icon

(Showing headlines 21 - 31)   1 2
Center Probe Test Socket has floating guide plate.

Center Probe Test Socket has floating guide plate.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 18, 2003 Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over 500,000 and can handle up to 2 A continuous current.

Test/Burn-In Socket accommodates devices up to 13 mm².

Test/Burn-In Socket accommodates devices up to 13 mm².

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 14, 2003 Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact for 0.80 mm pitches and larger. Socket operating temperature is -67 to 302°F.

RF Test Sockets feature conduction-cooled system.

RF Test Sockets feature conduction-cooled system.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 10, 2003 Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194°F, with max differential temperature of 158°F.

Test Socket handles device types up to 27 mm.

Test Socket handles device types up to 27 mm.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 14, 2002 Integra 27 has molded PPS plastic components designed to minimize space without sacrificing repeatability and durability. Device-specific spring probe insert can be machined to match testing needs. Socket's contacts are IDI spring probes, some which are electrically characterized to 10 GHz. Contacts are durable enough to handle burn-in and HAST testing. User replaceable contacts have current capacity of 3-6 A per and durability of 500,000 actuations.

Test Socket withstands rigors of burn-in and HAST testing.

Test Socket withstands rigors of burn-in and HAST testing.

Synergetix
Kansas City, KS 66106
Jun 26, 2002 Integra 27 has molded frame with custom-designed interposer insert and integral clamshell lid. Insert is loaded with spring-contact probes that offer insertion life of 500,000 cycles, inductance as low as 0.33 nH, and bandwidths well over 10 GHz. Socket is made of PPS with beryllium copper or nickel silver contacts. Temperature rating is -55 to +150°C.

Test Socket has probe self-inductance as low as 0.5 nH.

Test Socket has probe self-inductance as low as 0.5 nH.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 28, 2002 High frequency test socket has replaceable spring probe interposer, which enables users to accommodate two separate interposers with same base socket. Features include solderless, single-ended spring probes; four locating posts; and hinged lid, double-latched lid, or CAM-style lid options. Pitches are available from 0.5 to 0.8 mm, signal path lengths are 0.095 in., and contact resistance is less than 60 milliohms after 500,000 life cycles.

Test Socket eliminates co-planarity problems.

Test Socket eliminates co-planarity problems.

Andon Electronics Corp
Lincoln, RI 02865
May 20, 2002 BGA test socket has guided contact plunger that makes contact on periphery of solder ball, and maintains perpendicularity. Tapered cup design makes contact on angle and does not touch spherical radius of solder ball on bottom. Device features Rollerball(R) SMT technology and is available with solder tails for through-hole mounting. It is also available in 1.27, 1, 0.8, and 0.75 mm pitches.

Socket suits BGA/CSP testing.

Socket suits BGA/CSP testing.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 08, 2002 Interposer socket provides signal paths from 0.008 to 0.015 in. Able to work above 10 GHz, Interposer's contact system has dielectric material with etched pads on top and bottom. Socket offers pressure mount plunge-to-board interposer and pitches down to 0.3 mm. Contacts have self-inductance of 0.1 nH and resistance of less than 20 milliohms. Required contact force is 15 and 28 g (minimum) per contact for manual and automated applications, respectively.

Test Sockets are designed for high temperatures.

Test Sockets are designed for high temperatures.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 17, 2002 DIP Test Sockets, for 350°C and 500°C applications, have high temperature ceramic body and high conductivity stainless steel contacts. Normally closed contacts provide twin beam wiping action. They are plated with 50µ in. gold over 50µ in. nickel. Sockets accept .300 in. center to .600 in. center row-row devices, up to 28 positions with leads on .100 in. pitch. They are offered in through-hole or surface mount versions.

RF Test Sockets keep the pressure on.

RF Test Sockets keep the pressure on.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Dec 05, 2001 Spring-loaded lids on radio frequency (RF) test sockets provide consistent lead pressure. Precise pressure requirements can be met with mix-and-match springs from 1/2 to 25 lbs. Each socket comes with floating leadbacker built into every lid, and lids can be used throughout RF/microwave, automated handling and burn-in/life testing applications. Each socket has Microstrip Contacts, which can be used for any pitch device up to 208 leads.

Test Sockets have contact force of 30 g.

Test Sockets have contact force of 30 g.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Nov 28, 2001 RF high-frequency CSP/BGA test sockets have spring probe contacts that provide 500,000+ insertion/withdrawal cycles with no loss of contact force or increase in contact resistance. Sockets offer short signal paths of 0.098 in. for 1.00 mm and 1.27 mm pitch packages. Self-inductance of sockets is 0.62 nH and contact resistance is 30m Ohms after 500,000 cycles. Propagation delay is 45 psec and capacitance is 0.45 pF.




(Showing headlines 21 - 31)   1 2


Newsroom Advertisers



Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2008 Thomas Publishing Company
Terms of Use - Privacy Policy