Semiconductor Manufacturing International Corporation
Shanghai   China
Jun 16, 2009 Based on 2T PMOS flash (pFLASH(TM)) architecture, 0.18 µm embedded flash memory process provides non-volatile solution with endurance rated up to 100K cycles and data retention of up to 10 years. Design is optimized for configuration flexibility as well as minimal power consumption and space. Suitable applications include MCUs, USB keys, smartcards, and devices for automotive market.

austriamicrosystems AG
Premstatten   Austria
Jun 12, 2009 Through Silicon Via (TSV) technology enables two 8 in. wafers to be electrically connected. With typical TSV depths of 200-300 µm, it addresses variety of markets requiring 3D integration of CMOS ICs, photo sensors, gas sensors, power devices, or MEMS components such as automotive, industrial, and consumer applications. Flexible manufacturing concept allows for customer specific modifications, and varying wafer thicknesses can be supported.

TSMC
Hsinchu   Taiwan
Apr 16, 2009 Suited for power-sensitive, automotive, and analog applications, 0.18-micron embedded flash (embFlash) process technology family includes baseline 1.8-5 V standard process, ultra-low leakage process, and specific automotive-qualified embedded Flash IP. Process features one low-voltage Flash IP that fully functions at 1.8 V; several Flash IP macros and customization service are available. Process suits large appliance motor controls on refrigerators, washing machines, and A/C units.

MagnaChip Semiconductor
Cheongju-si,Chungbuk   Korea (south)
Dec 09, 2008 Offered to foundry customers, 0.18 and 0.35 µm aBCD (Advanced Bipolar CMOS-DMOS) process technologies adopt DTI (Deep Trench Isolation) process to satisfy reliability and latch-up requirements. Both voltage-scalable solutions are optimized for low Rsp (Specific Ron), promoting drive capability for power management ICs, and reduce high voltage transistor pitch with DTI technology. Switching speed is achieved by removing parasitic resistance and capacitance between high voltage wells.

Raymarine Inc.
Nashua, NH 03063
Nov 11, 2008 Featuring flush-mounted, 6.42 x 3.84 in. design, G-Series Compact Keyboard offers control of up to 4 G-Series displays and 4 GPM400 processors. LED indicators enable captains to determine which display and GPM400 is currently under command. Keyboard also offers color coded softkeys for control that simplify navigation.

Silterra Malaysia Sdn Bhd
Kedah Darul Aman   Malaysia
Aug 21, 2008 Featuring 2.13 micron square SRAM bitcell optimized for high density embedded memory design for high resolution WQVGA, HVGA, and VGA TFT panels with 2.5 in. panel size and above, CL130H32 is 0.13 micron high voltage technology. It offers Asymmetry High Voltage Well for denser design, one-time-programmable cell for gamma color tuning and voltage trimming, ESD protection, and metal capacitors design guideline.

austriamicrosystems AG
Schloss Premstaetten A 8141  Austria
Jul 23, 2008 To ensure ESD robustness of complex analog/mixed-signal designs in power management, automotive or medical applications, 0.35 µm High-Voltage CMOS process technology (H35) offers 4 kV HBM ESD protection level for 50 V max supply voltage. This periphery library includes fully scalable High-Voltage NMOS and PMOS devices, floating logic libraries, as well as optimal power-on resistance. Process allows integration of 3.3/5/20/50/120 V devices on one chip.

Molex Inc.
Lisle, IL 60532-1682
Jul 11, 2008 Optimized for fatigue strength, Solder Charge Surface Mount Technology (SMT) attach method exhibits sloping solder filet that provides durable attach method for its sheer strength and pull-force. Use results in increased PCB retention strength, precise formation of stamping die, and mechanical designs that allow for visual inspections post processing. Flexible solder mass compensates for board warping, and solution is available in tin-lead or lead-free designs.

Pickering Interfaces Inc
GRANTS PASS, OR 97526
Mar 06, 2008 Offered as 4- or 8-slot BRIC module, 40-569 integrates 16-wire analog bus with BUS Matrix cards and Resource Distributor cards. Scalable design permits inclusion of up to 2 off Resource Distributor subsystems and 6 off Bus Matrix subsystems. Also available, 40-618 Source Switching Module implements switching functions defined in Appendix D of ARINC specification. Each module can be supported in any 3U PXI chassis or Pickering Interfaces LXI Modular Switching Chassis.

Photo Sciences, Inc.
Torrance, CA 90505
Nov 20, 2007 Multifaceted microlithography techniques pattern photoimageable color polymer-coated substrates using direct-write laser, direct-write e-beam, optical reduction, and full field exposure lithography. Photoimageable color polymers provide means of producing microscopic patterns in various standard colors as well as custom polymer colors. Line widths can be produced as small as 2 microns in color polymers, offering compatible with nanoscale applications.

Silterra Malaysia Sdn Bhd
Kedah Darul Aman   Malaysia
Nov 09, 2007 Suited for devices used in construction of TFT panels, 0.16 µm High Voltage Technology features 3.17 µm² SRAM bitcell which facilitates high density embedded memory design in display driver for QVGA (240 RGB x 320) and WQVGA (320 RGB x 432, Wide-Quarter-VGA) TFT panels. Technology offers asymmetry high voltage well for denser design, one-time-programmable cell for gamma color tuning, ESD protection, and metal capacitors design guidelines.

Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Chu 300, R.O.C.  Taiwan
Aug 09, 2007 With advanced standard cell, standard I/O, and SRAM compiler, Reference Flow v8.0 provides mature design flows for mainstream technologies from 0.13-0.25 micron. It offers intra-die statistical timing analysis along with statistical leakage and statistical timing optimization. Automated DFM (design for manufacturability) hot spot fixing eliminates need for manual correction, while DFM electrical variability consideration monitors parametric performance shifts caused by DFM effects.

Zarlink Semiconductor
Ontario K2K 3H4  Canada
Jun 05, 2007 With modular WPX power management process, designs can be developed using minimal layers in applications such as DC-DC power bricks, mobile telephone battery power management, linear and switching regulators, and other linear power management applications. This low-capacitance, linear bipolar process features lateral PNP transistors, poly resistors, and nitride capacitors. Its 2-layer metal allows low-current circuits to be built with high packing densities.

austriamicrosystems AG
Premstatten   Austria
May 18, 2007 Utilizing 0.35 µm SiGe-BiCMOS process technology, 2.7, 3.3, 5, and 12 V devices can be integrated on single chip without any process changes. Devices rated at 12 V enable high frequency operations, such as NPNs with BVceo of 14 V and ft/fmax of 15/32 GHz and RF-PLMDOS with BVds of 18 V and ft/fmax of 11/28 GHz. SiGe-BiCMOS technology is suited for users developing products such as line drivers for xDSL modems, Ethernet applications, and power amplifiers.

Optotherm, Inc.
Sewickley, PA 15143
Apr 02, 2007 PCB Test Arm Probe provides probing of surface mount devices (SMDs), and connects test instruments to variety of SMDs including PLCC, SOIC, QFP, and VIAS or test point holes. With length of 8.33 in., height of 2.92 in., and base length of 2.53 in., it includes spring loaded tip, rotatable head, and fine vertical adjustment knob, and is available in 3 and 10 A models. Connection post supports single or multiple test leads.

MH&W International Corporation
Mahwah, NJ 07430
Mar 19, 2007 Keratherm® 86/77 provides electrically conductive bonding sites on flexible material that attaches to non-linear, heat spreading structures. Flexible thermal circuit consists of thin layer of etchable copper bonded to thermally conductive silicone film, and can be applied to curved and irregular surfaces with peel-and-stick attachment. Secured with thermally conductive adhesive, conformable material ranges from 0.16-0.326 mm thick.

Trimble Navigation Limited
Sunnyvale, CA 94085-3913
Jan 29, 2007 Designed for agricultural applications, AgGPS® EZ-Guide® 500 provides GPS-based guidance for steering tractors, sprayers, fertilizer applicators, air seeders, and tillage tools that require consistent pass-to-pass accuracy. Color, 7 in. LCD shows plan and perspective views, which let user see covered area in real-time. Built-in lightbar has guidance LED array that is visible even in direct sun, and data logging function lets users record day's work and transfer it to PC.

Motorola, Inc.
Schaumburg, IL 60196 4041
Jan 10, 2007 Comprised of 6 models, Motorola DCH Series delivers surround sound audio as well as SD and HD video that can be scaled to 720p or 1080i resolution. Products include hard drive for time- and place-shifting capabilities as well as media storage. Enabling on-demand and interactive digital cable programming, series provides connectivity via High-Definition Multimedia Interface®, optical and coaxial digital audio outputs, and IEEE 1394a, USB, and Ethernet interfaces.

Tyco Electronics Corp.
Harrisburg, PA 17105-3608
Nov 14, 2006 Universal MATE-N-LOK connectors are available with plugs, caps, and headers in red, orange, yellow, brown, green, blue, gray, black, or white. Different colors let designers color-code interconnections within device they are designing, meet system color-coding protocols, or promote visibility of wiring harnesses and assemblies. Constructed of UL 94V-0 or UL 94V-2 material, molded plastic products are RoHS-compliant and carry UL recognition, CSA certification, and VDE approvals.

Altera Corporation
San Jose, CA 95134
Nov 14, 2006 Supporting Stratix® II, Stratix II GX, and Cyclone® II FPGA families or MAX® II CPLDs, RoHS-compliant development kits provide complete design environment that accelerates project creation/implementation. Each kit is available with complete board design files, including schematics, layout, and bill of materials. Specific products include Nios® II Development Kits, DSP Development Kits, Transceiver Signal Integrity Kit, PCI/PCI Express Development Kit, and Audio/Video Development Kit.