Rehm Thermal Systems
Blauberen   Germany
Apr 01, 2009 Equipped with 2 conveyor lanes that can be operated asynchronously at different speeds, Dual Lane Vision X Series enables simultaneous lead-rich and lead-free reflow soldering. Conveyors can be loaded with diverse PCBs printed with different solder pastes. Available with air or nitrogen atmosphere, convection soldering system includes integrated residue management system and ovens with homogenous, non-separated heating and cooling zones across width of conveyor.

Unitek Miyachi Corporation
Monrovia, CA 91017 7133
Oct 24, 2008 Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires.

Unitek Miyachi Corporation
Monrovia, CA 91017 7133
Sep 20, 2007 Desktop Series Hot-Bar Reflow Soldering Systems use pneumatic force control to replace spring technology and cover full range of SH500 bonding head up to 500 N. Force is set by manual knob and set range is displayed by digital screen on head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.

Juki Automation Systems
Morrisville, NC 27560
May 23, 2005 Model 300L and 400L are suited for selective soldering of conventional (through-hole) components after reflow process. First machine can utilize pre-heater and includes bare board or mask grippers, internal spray or drop jet fluxers, and various soldering nozzles from 4–30 mm dia. Building on features of 300L, 400L offers 3-stage inline system for automated soldering process. It can also be customized to meet specific requirements.

PBI-Dansensor America Inc.
Glen Rock, NJ 07452
Nov 17, 2004 MAP Check 9000 PFC Re-Flow and Wave Soldering System offers single control point for maintaining max quality of end product with minimal scrapping, rework, and gas consumption. It merges PBI-Dansensor MAP Check and MAP Con products into one instrument, and includes on-line process gas analyzer. All system parameters are monitored via self-diagnostics function that includes sensor flow detection with user-defined gas concentration alarms.

FocalSpot, Inc.
San Diego, CA 92131
Dec 31, 2003 Designed for both lead-free and standard solder, Den-on Instruments RD-500SH vision-based, semi-automated reflow, removal, and placement rework station uses combination of dark IR and localized Hot Gas heating technology. It combines top and bottom heaters with auto-profiling technology to heat and reflow demanding rework applications. Features include Den-on Auto-profiling software; 400 X 420 mm board capacity; digital, dual-vision imaging system; and vacuum pump.