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Materials & Material Processing -> Soldering Equipment & Supplies -> Soldering Machines


Soldering Machines







(Showing headlines 1 - 20)   more ....
Selective Soldering System  features modular design.

Selective Soldering System features modular design.

SEHO Systems GmbH    Kreuzwertheim 97892  Germany
Apr 11, 2014 With no change-over required, SEHO SelectLine can dynamically process variety of assemblies with short cycle times. Fluxer module, various preheat modules, and soldering modules may be equipped individually, and depending on requirements, they can be configured into complete manufacturing line. Two electro-magnetic soldering units for mini-wave processes may be integrated. With automatic ultrasonic cleaning unit, liquid solder is set into oscillation which gently cleans surface of nozzle.

Advanced Reflow Systems include batch ovens and inline variants.

Advanced Reflow Systems include batch ovens and inline variants.

Seika Machinery, Inc.    Torrance, CA 90503
Mar 10, 2014 Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering.

Batch Selective Soldering System offers operational flexibility.

Batch Selective Soldering System offers operational flexibility.

Juki Automation Systems    Morrisville, NC 27560
Feb 19, 2014 Able to be configured with single nozzle or 2 nozzles, CUBE.460 offers batch platform with flexibility for through-hole applications. Selective mini-wave soldering system supports exchangeable solder pot for dual alloys and comes with various features: heated nitrogen at soldering nozzle; 0° and 7° soldering to accommodate various types of nozzles, including wetted nozzle tips and non-wetted nozzles; live viewing camera, and Quartz IR bottom side preheater.

Print-Place-Reflow Package performs prescision, high-mix assembly.

Print-Place-Reflow Package performs prescision, high-mix assembly.

Manncorp    Willow Grove, PA 19090
Jan 29, 2014 Occupying minimal floor space, 2500-MV accommodates companies that require short-run, in-house production capability for ultra-precise, high component-mix SMT assembly. Included MC-400 pick and place system features Cognex® on-the-fly and bottom vision alignment for high-accuracy, 2,500 cph placement of SMDs. Additional package components include heavy-duty MC-110 stencil printer, which offers ±0.02 mm (<1 mil) repeatability, and MC-301 profilable batch reflow oven with benchtop design.

Vapor Phase Reflow Soldering System has compact footprint.

Vapor Phase Reflow Soldering System has compact footprint.

Rehm Thermal Systems    Blauberen   Germany
Jun 18, 2013 In addition to 3-step profiling with principle of injection (5 with void reducing vacuum), CondensoXS vapor phase condensation reflow soldering system offers horizontal transport of assembled board to prevent components from slipping. Use of injection principle and control of temperature and pressure (vacuum) allow precise and diverse reflow profiling. Measuring complex requirements of lead-free soldering of units with high thermal mass, unit accelerates reliable solder of heavy units.

Reflow Soldering System offers void-free results. .

Reflow Soldering System offers void-free results. .

SEHO Systems GmbH    Kreuzwertheim 97892  Germany
Feb 20, 2013 Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures homogeneous heat distribution with large volume of ventilated process gas.

Selective Soldering System features benchtop design.

Selective Soldering System features benchtop design.

Manncorp    Willow Grove, PA 19090
Jan 21, 2013 Suited for companies that hand solder through-hole components on PCBs, ULTIMA TR2 is equipped with 35 lb-capacity solder pot that handles lead-free or Sn/Pb solders. Integral nitrogen hood with micro pre-heater inerts solder site and stabilizes wave temperature, while 3-axis drive mechanism moves PCB with positional accuracy of ±0.01 mm. Point-to-point and drag soldering functions, along with solder pump speed, wave height control, dip height, and dwell parameter settings, are fully programmable.

Selective Soldering System offers in-line concurrent processing.

Selective Soldering System offers in-line concurrent processing.

ACE Production Technologies    Spokane Valley, WA 99216
Jan 21, 2013 Fully-configured SMEMA-compatible, KISS-205 Selective Soldering System combines fluxing, pre-heating, and soldering into simultaneous functions to achieve gains in productivity. Dual universal PCB edge conveyor provides program controlled width adjustment, positive PCB location, and PCB flattening. Additional features include automated fiducial XY and skew correction, volumetric atomized and/or drop jet fluxer, and independently controlled dual pre-heater modules.

Selective Soldering System requires 36 x 31 in. of table space.

Selective Soldering System requires 36 x 31 in. of table space.

Manncorp    Willow Grove, PA 19090
Oct 10, 2012 Suitable for soldering through-hole components and connectors to SMT and mixed technology PCBs, ULTIMA TR2 incorporates X-, Y-, Z-axis drive that moves PCB, rather than solder pot. Solder pot and pump assembly features integral nitrogen hood with built-in micro-preheater for inerting solder site and stabilizing wave temperature. Via bottom-side witness camera, operator can view live video of soldering process on laptop/PC. Universal PCB holders handle boards up to 13 x 10 in. or 18 x 15 in.

Solder Reflow Oven features dual-lane, dual-speed design.

Solder Reflow Oven features dual-lane, dual-speed design.

BTU International, Inc.    North Billerica, MA 01862
Aug 13, 2012 PYRAMAX(TM) features High Efficiency flux management system, which collects flux residue by processing oven atmosphere from multiple extraction points through series of heat exchangers, ensuring clean operation. Dual-lane design doubles throughput of oven by allowing 2 boards to be run simultaneously in parallel, with identical or near identical boards. With ability to adjust one lane while other lane continues production, WINCON 5.0 control software offers true dual process capability.

Automated Selective Soldering Machine processes 12 x 12 in. PCBs.

Automated Selective Soldering Machine processes 12 x 12 in. PCBs.

ACE Production Technologies    Spokane Valley, WA 99216
May 24, 2012 Intended for companies performing prototype volume, quick turn jobs that have few through hole components, entry-level KISS 101A uses traveling mini-solder wave soldering process and features controls mounted in a way that minimizes system footprint. Universal PCB location rails are standard, and lead or lead-free alloy solder pot and pump assembly are available. Along with 6 and 12 mm bullet nozzles, features include programming camera, teach functions, and programmable process parameters.

Dual-Wave Solder Machine facilitates lead-free-to-Pb switchover.

Dual-Wave Solder Machine facilitates lead-free-to-Pb switchover.

Manncorp    Willow Grove, PA 19090
Oct 11, 2011 Measuring less than 5½ ft long, Model 16.350 can be configured with 2 pots on roll-out carts to provide lead-free-to-Pb switching. System features 200 kg solder pot capacity, 350 mm wide adjustable finger conveyor with built-in cleaner, and 600 mm pre-heat tunnel with forced hot air convection for thorough and even heat penetration. In addition to motorized inlet conveyor, Model 16.350 includes motorized spray that evenly distributes flux.

Selective Soldering Fixture measures process stability.

Selective Soldering Fixture measures process stability.

Datapaq Inc.    Wilmington, MA 01887
Mar 02, 2011 To help optimize manufacture of electronic assemblies, Model PA2200A uses 2 sensors to monitor performance of pre-heat stage of process and 3 sensors to monitor dip soldering stage. Dip soldering thermocouples enable monitoring of solder temperature, as well as dwell time in solder, and can be set at different heights to allow for measurement of contact time at various depths. System also generates detailed reports on selective soldering operation.

Reflow Soldering System suits small/medium volume production.

Reflow Soldering System suits small/medium volume production.

Aps Novastar LLC    Huntingdon Valley, PA 19006
Jan 26, 2011 With 5 vertical heating zones and 1 cooling zone, ERO-500 conveyor reflow oven accommodates small- to medium-volume reflow soldering of SMT boards and hybrid boards as well as curing of glue or thick film pastes. Max temperature is 320°C, allowing optimized reflow profiles for Pb-free and Pb solder. Independently programmable heating zones are controlled through on-board LCD system controller, and plenum convection heating technology provides uniform temperature profiling across PCB.

Selective Soldering Systems offer dual-monitor option.

Selective Soldering Systems offer dual-monitor option.

ACE Production Technologies    Spokane Valley, WA 99216
Nov 09, 2010 With Dual Monitor feature, Selective Soldering Machines give operator high-resolution image of any or all camera functions on one monitor, plus larger display of all machine function or programming screens on another, adjacent, flat-screen monitor. Monitors deliver clear views of specific soldering sites as well as precise setup and alignment. Feature is standard on all KISS 104 systems and is available as option on KISS-102 and KISS-103 systems.

Selective Soldering Machines deliver zero defect solder joints.

Selective Soldering Machines deliver zero defect solder joints.

Aps Novastar LLC    Huntingdon Valley, PA 19006
Aug 13, 2010 Designed for short run, mixed technology applications, Models ESS310 and ESS500 handle max board size of 12 x 12 in. and 19.7 x 19.7 in., respectively, while providing single point, drag, mini-wave, or dip soldering. Machines feature 100% IR preheat, 33 lb solder capacity, and spray flux system. With warm up time of approximately 45 min, systems reach max temperature of 725°F and consume 0.8-1.7 cfm nitrogen, depending on nozzle and nozzle shroud.

Wave Soldering Machine includes finger conveyor.

Wave Soldering Machine includes finger conveyor.

Aps Novastar LLC    Huntingdon Valley, PA 19006
Aug 13, 2010 Featuring self-contained fluxing, preheating, and laminar solder wave modules, Model EWS-310 offers continuous width adjustment for boards up to 11.8 in. Machine has welded steel frame, on-board profiler, 200 lb solder pot capacity, and max conveyor speed of 98.4 ips. With warm-up time of approximately 60 minutes, Model EWS-310 provides max Preheat 1 temp of 302°F and max Preheat 2 temp of 392°F. It is compatible with both lead and lead-free processes.

Soldering Nozzles are available in custom designs.

Soldering Nozzles are available in custom designs.

Count On Tools    Gainesville, GA 30501
Jun 01, 2010 Available on entire line of selective soldering machines, Pillarhouse AP-1 Universal Nozzles can consistently apply flux and solder to component leads without disturbing nearby SMT components. Units are made of steel alloy and range in size from 2.5-12 mm. Identification marks enable users to differentiate lead nozzles from lead-free versions.

Compact Wave Solder Machine suits mid-volume operations.

Compact Wave Solder Machine suits mid-volume operations.

Manncorp    Willow Grove, PA 19090
May 06, 2010 Measuring only 5½ ft long, dual wave System 16.350 includes 13.75 in. wide titanium automatic finger conveyor with built-in finger cleaner. Processing temperatures can be set to lead-free or tin-lead requirements to 300ºC. Other features include convection pre-heat, adjustable spray fluxer, touch-screen control, and low solder warning.

Selective Soldering System handles mixed technology PCBs.

Selective Soldering System handles mixed technology PCBs.

Manncorp    Willow Grove, PA 19090
Apr 27, 2010 Delivering dip-and-drag selective soldering for post-reflow, through-hole components, and odd forms, IS-450 uses under-board mini-wave to precisely solder connectors, capacitors, and high-power devices onto boards at lead-free process temperatures of 250-330ºC. System is programmable off-line to govern wave temperature and height, as well as travel speed and dwell time at each point. Even when processing densely populated boards, system maintains adjustable clearance of as little as 1.5 mm.




(Showing headlines 1 - 20)   more ....



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