Manncorp
Willow Grove, PA 19090
Jul 23, 2009 Offered as compact (9.5 ft long) dual-pot system, Model 28.400-2 is mounted on transport and storage carts that allow conversion from Pb-free to tin-lead. It features dual-wave, 3 independently controlled zones with forced-air convection heating, and bottom-side IR preheating. Other features include internal automatic spray fluxing, titanium finger conveyor with motorized width adjustment for PCBs from 2-15.75 in., and closed-loop control of conveyor speed.

ACE Production Technologies
Spokane Valley, WA 99216
Jul 01, 2009 Selective Soldering Process Development Lab is available with CM-60 Ionic Contamination Tester (cleanliness test), which provides features such as CM-Series Volumetric Measurement cell that automatically calculates surface area to be tested. GEN3 Systems' CM-60 System can test in accordance with IPC/ANSI-J-STD001D and UK DEF-STD as well as other international specifications. Lab is fully equipped with range of soldering equipment, process development tools, and selective soldering tools.

Rehm Thermal Systems
Blauberen   Germany
Apr 01, 2009 Equipped with 2 conveyor lanes that can be operated asynchronously at different speeds, Dual Lane Vision X Series enables simultaneous lead-rich and lead-free reflow soldering. Conveyors can be loaded with diverse PCBs printed with different solder pastes. Available with air or nitrogen atmosphere, convection soldering system includes integrated residue management system and ovens with homogenous, non-separated heating and cooling zones across width of conveyor.

ACE Production Technologies, Inc.
Spokane Valley, WA 99216
Mar 24, 2009 Featuring analog controls, bench-top KISS 101A is programmable in X, Y, and Z axes and utilizes ACE Laser Point teach and align process. System accommodates PCBs from 2 x 2 in. up to 12 x 12 in. as well as connectors up to 10 in. long. Variety of standard and custom nozzles is available, from 3 mm bullet nozzle to 3 in. wide wave. Offered with optional lead-free compatible solder pot, KISS 101A is suited for assembly, prototyping, rework, and post-reflow offline assembly.

Manncorp
Willow Grove, PA 19090
Feb 27, 2009 Measuring 98.4 x 43.4 x 63 in. and supplied with 220 lb titanium solder pot, ECO-300 lead-free wave solder machine features heavy-duty, transducer-controlled pump motor that promotes precision solder wave uniformity and height control. Other features include automatically recirculating adjustable titanium finger conveyor for board widths to 11.8 in., and 32 in. preheat zone with stainless steel sheath-type IR heaters. Total power consumption is rated at 15 kW.

Coherent Inc., Laser Group
Santa Clara, CA 95054-1112
Feb 16, 2009 Configured with 1-4, 100 W, 200 µm diode modules, HB-Diode laser system either fiber-delivers output from each module individually, or combines output into single, 0.22 NA delivery fiber. It provides 100, 200, 300, or 400 W of output power, at fiber diameters of 200, 400, 600, or 800 µm respectively. Featuring 19 in. rack mount form factor, armored fiber, air-cooling, aiming beam, and selection of fiber imaging optics, system can be integrated into variety of applications.

Vitronics Corp.
Stratham, NH 03885
Oct 30, 2008 With wave height measurement system, mySelective 6748 ensures specific predetermined wave height for every PCB by automatically adjusting solder pump rpm. Closed-loop system uses laser-based sensor to detect, measure, and monitor SelectWave height. It prevents loss of cycle time and stores individual PCB settings in system's Management Info Database for later recall. With mySelective 6748, each joint can be soldered under optimum process parameters.

Unitek Miyachi Corporation
Monrovia, CA 91017 7133
Oct 24, 2008 Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires.

Manncorp
Willow Grove, PA 19090
Sep 23, 2008 Measuring 50 x 30 in., lead-free Model C250 is equipped with adjustable corrosion-resistant finger conveyor, automatic defluxing, IR preheating, air-knife cooling, and low-volume solder pot. Machine is available in either single or dual wave configurations for through-hole and surface mount assemblies. It also includes built-in solder pot loading, maintenance platform with locking support mechanism, and dial-adjustable wave height control.

ACE Production Technologies
Spokane Valley, WA 99216
Aug 28, 2008 Capable of handling demanding applications, Selective Soldering Equipment features 0.0001 in. resolution linear encoder technology that provides closed-loop feed-back, indicating exact location of solder nozzle and ensuring repeatable accuracy of ±0.001 in. Machine can repeatedly position the center of solder nozzle at given location for precision soldering results regardless of motor positions, even when soldering tiny components.

ACE Production Technologies
Spokane Valley, WA 99216
Mar 28, 2008 Suitable for tight pitch components in high-volume automated production environments, Wave Height Monitor and control module maintain solder wave heights to within ±0.005 in. when intalleed on KISS line of selective soldering equipment. System works with wave nozzle sizes under 6 mm down to 1.5 mm. Combination of height monitoring circuit with nitrogen inerted solder delivery system and nitrogen air-knife incorporates resistive measurements of wave height relative to known reference.

Manncorp
Willow Grove, PA 19090
Feb 11, 2008 Accommodating low- to mid-volume PCB assemblers, MT-300 is available for high-density through-hole soldering as well as SMT and mixed technology applications. Dual-wave design is complimented by transducer-controlled twin pump motors that ensure precise and uniform wave heights. Also included, adjustable titanium finger conveyor can transport boards from 1.2-11.8 in. wide. Solder pot, wave nozzles, and pumping system are all of corrosion-resistant titanium alloy.

Manncorp
Willow Grove, PA 19090
Dec 20, 2007 Offering adjustable temperature range to 399°C, multi-purpose, mini wave System 120 is designed for single-point or single-edge soldering and removal of ICs, including DIPs, QFPs, PGAs, connectors, and odd forms. When wave is activated, Z-motion immersion takes place with nozzle encapsulating component and dwell time governed by foot switch. Bench-top unit is suited for lead-free or tin/lead processing, and short runs requiring selective soldering.

Manncorp
Willow Grove, PA 19090
Nov 14, 2007 Featuring semi-automatic design, Auto Dip can process single board or pallets up to 19.3 x 12.5 in. in 2-12 sec. Boards are placed on fixtureless ultra-fine needle bed, which retains PCBs without components being dislodged when dipped into solder bath. Solder is evenly applied while surface tension floats boards at correct wetting height, and built-in motorized skimmer removes dross as needed. Adjustments exist for dwell time, temperature from 220-299 Cº, and dipping angle.

Unitek Miyachi Corporation
Monrovia, CA 91017 7133
Sep 20, 2007 Desktop Series Hot-Bar Reflow Soldering Systems use pneumatic force control to replace spring technology and cover full range of SH500 bonding head up to 500 N. Force is set by manual knob and set range is displayed by digital screen on head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.

Manncorp
Willow Grove, PA 19090
Jun 26, 2007 Pb-free MT-300 is available for low- to mid-volume PCB assemblers seeking defect-free soldering of high-density boards populated with through-hole, SMT, or mixed technology components. This 8 ft long system utilizes dual transducer-controlled motors for uniform wave heights and includes adjustable titanium finger conveyor with max board width of 11.75 in. Automatic finger cleaner is standard, as are titanium-alloy solder pot, wave nozzles, and heavy-duty pumping system.

Vitronics Corp.
Stratham, NH 03885
May 07, 2007 Delta flexible wave soldering platform features EasyUse OI for programming, setup, and process changes, preheating and fluxing, and atmosphere control that makes platform fully lead-free capable. Automatic removal of dross, chipwave nozzle open access, and separate dross compartment help optimize preventive maintenance procedures. Featuring wave height measurement, platform is available in Delta models 5 and 7.

A.C.E Production Technologies
Wilder, KY 41076
Nov 08, 2006 Able to handle large PCB's and panelized boards, KISS 104 large-format selective soldering system allows user to place multiple boards in work area and then utilize Step-and-Repeat feature of system's operating program. It incorporates upward-looking camera for point-to-point programming, traveling mini-solder wave, and swappable lead-free compatible solder pots to prevent cross-contamination. System is suited for assembly, prototyping, and rework applications.

Tyco Electronics Corp.
Harrisburg, PA 17105-3608
Oct 04, 2006 Conforming to SMEMA in-line manufacturing standards, Rhythm Selective Soldering System provides entry point for soldering through-hole and odd form components into surface-mount and mixed technology PCBs. System presents solder from underside of PCB without any special tooling or accessories. Processing capabilities such as small keep-away is made possible by tilting axis. For applications with high thermal demands, machine can be equipped with optional infrared preheater.

Speedline Technologies Inc.
Franklin, MA 02038
Oct 03, 2006 Designed for VectraElite(TM) Wave Soldering Systems, ServoSpray(TM) servo-controlled, reciprocating spray fluxing system features air atomized spray head, pressure tank flux supply system, self-cleaning nozzle capability, and ability to spray in one or both directions. With separate flux and air valve to control atomizing nozzle, fan-like spray pattern is delivered parallel to PCB holes and pallet openings to maximize hole penetration and transfer efficiency.