Soldering Machines

Materials & Material Processing

Wave Soldering System combines capacity and capability.

June 17, 2014

Optimized for production capability and capacity, Electrovert® Electra™ uses IsoThermal convection pre-heat. Full nitrogen tunnel can be field upgraded, and Intelligent Flux Control is available with Full Tunnel feature. Along with 24 in. process width capability, this wave soldering system features integrated fume extraction, dual head ServoJet™ fluxing and DwellMax™ Plus solder nozzles. Read More

Materials & Material Processing

Dip Soldering Systems suit short-run, batch applications.

May 14, 2014

Touchscreen controlled models of Auto-Dip series feature programmable preheat and dip height settings as well as adjustable, finger-type PCB holder that firmly grips edges of board throughout soldering cycle. Accommodating heavy component-laden assemblies and customized pallets of small, irregularly-shaped PCBs, systems offer programmable speed, dip angle, lift angle, and dwell time. Largest model handles PCBs up to 23.6 x 13.8 in. and has 100 Kg, titanium solder pot. Read More

Materials & Material Processing

Selective Soldering System features modular design.

April 11, 2014

With no change-over required, SEHO SelectLine can dynamically process variety of assemblies with short cycle times. Fluxer module, various preheat modules, and soldering modules may be equipped individually, and depending on requirements, they can be configured into complete manufacturing line. Two electro-magnetic soldering units for mini-wave processes may be integrated. With automatic ultrasonic cleaning unit, liquid solder is set into oscillation which gently cleans surface of nozzle. Read More

Thermal & Heating Equipment, Materials & Material Processing

Advanced Reflow Systems include batch ovens and inline variants.

March 10, 2014

Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering. Read More

Machinery & Machining Tools, Materials & Material Processing

Batch Selective Soldering System offers operational flexibility.

February 19, 2014

Able to be configured with single nozzle or 2 nozzles, CUBE.460 offers batch platform with flexibility for through-hole applications. Selective mini-wave soldering system supports exchangeable solder pot for dual alloys and comes with various features: heated nitrogen at soldering nozzle; 0° and 7° soldering to accommodate various types of nozzles, including wetted nozzle tips and non-wetted nozzles; live viewing camera, and Quartz IR bottom side preheater. Read More

Computer Hardware & Peripherals, Printing & Duplicating Equipment, Thermal & Heating Equipment, Robotics, Materials & Material Processing

Print-Place-Reflow Package performs prescision, high-mix assembly.

January 29, 2014

Occupying minimal floor space, 2500-MV accommodates companies that require short-run, in-house production capability for ultra-precise, high component-mix SMT assembly. Included MC-400 pick and place system features Cognex® on-the-fly and bottom vision alignment for high-accuracy, 2,500 cph placement of SMDs. Additional package components include heavy-duty MC-110 stencil printer, which offers ±0.02 mm (<1 mil) repeatability, and MC-301 profilable batch reflow oven with benchtop design. Read More

Materials & Material Processing

Vapor Phase Reflow Soldering System has compact footprint.

June 18, 2013

In addition to 3-step profiling with principle of injection (5 with void reducing vacuum), CondensoXS vapor phase condensation reflow soldering system offers horizontal transport of assembled board to prevent components from slipping. Use of injection principle and control of temperature and pressure (vacuum) allow precise and diverse reflow profiling. Measuring complex requirements of lead-free soldering of units with high thermal mass, unit accelerates reliable solder of heavy units. Read More

Machinery & Machining Tools, Robotics, Materials & Material Processing

Reflow Soldering System offers void-free results. .

February 20, 2013

Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures homogeneous heat distribution with large volume of ventilated process gas. Read More