Labels, Tags, Signage & Equipment, Paints & Coatings

Solder Paste Stencil is available for custom stencil designs.

February 11, 2014

Able to be applied to existing production stencils, chemistry of NanoSlic® Gold coating imparts hydrophobic and oleophobic surface to apertures and underside of stencil; non-stick surface resists solder paste build-up and reduces cleaning cycle requirements.  Nano coating permanently bonds and conforms to aperture walls regardless of size or geometry. Abrasion surface withstands repeated cleaning, and paste release enables high-yield printing at low area SARs (surface area ratios). Read More

Labels, Tags, Signage & Equipment

Stencil for Solder Paste Printing increases yield, reduces waste.

January 29, 2014

Developed to address electronic assembly industry demands, NanoSlic® Gold stencil features coating based on application process that coats both underside of stencil and aperture walls. Thermally cured and permanent coating is hydrophobic and oleophobic, which repels solder paste. Minimizing rework while increasing yields, properties promote solder paste transfer efficiencies for small apertures. Furthermore, properties minimize bridging and reduce underside cleaning. Read More

Labels, Tags, Signage & Equipment, Materials & Material Processing

Masking Stencil targets automotive refinishing applications.

July 1, 2013

Engineered from 304 stainless steel, SHIM-MASK serves as masking stencil to prevent rub-through during sanding or shaving of minor surface imperfections. Four chemically etched shapes with smooth edges are available to choose from. Product is suited for paint and lacquer runs as well as minimizing area when sanding paint-filled chips or scratches. Read More

Labels, Tags, Signage & Equipment, Printing & Duplicating Equipment, Green & Clean

Fine Line Stencil helps maximize solar cell efficiency.

May 29, 2013

Ensuring printed line height uniformity, Fine Line Stencil™ enables sub-40 µm line widths with no increase in line resistance. When used in dual print process, stencil first prints busbars with fine mesh screen, and then separately prints conductors. This allows optimized paste to be used for each process which not only gives precise control over print height of busbars and fine lines, thereby saving silver, but also allows non-contacting busbar paste to increase Voc and therefore cell efficiency. Read More

Computer Hardware & Peripherals, Labels, Tags, Signage & Equipment, Printing & Duplicating Equipment

Interchangeable Stencil offers consistent tension over time.

May 6, 2013

In addition to optimized solder paste deposition and definition, VectorGuard™ High Tension features foil tension of 33 N/cm², transferred evenly on all 4 sides. Product has no glue bonds to fail and offers frame flatness for process control and repeatability of position from foil to foil of same product, minimizing time to switch stencil. Long-term integrity of stencil ensures no tension degradation over time. Read More

Labels, Tags, Signage & Equipment

Stencil Technology meets challenging aspect ratios down to .46.

April 8, 2011

NicAlloy-XT(TM) stencil incorporates NiPlate(TM) process, ensuring smooth aperture walls and offering optimal paste release and under screen clean performance. Manufacturing processes produce uniform stencil thickness, while NanoCoat(TM), supplied as standard, ensures delivery of optimal quality print deposit. Product offers alternative to electroform stencils as well as traditional laser cut stencils. Read More

Labels, Tags, Signage & Equipment, Printing & Duplicating Equipment

3D Stencil targets multi-level printing applications.

December 7, 2010

Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables uniform stencil thickness to be achieved for quality print results. Electroformed nickel stencil not only prints 2 levels simultaneously, but can also accommodate levels that differ by up to 3 mm. In addition to providing coverage for dedicated areas on board, VectorGuard 3D is suitable for printing of heatsink pockets for power components or printing of 3D mounting PCBs. Read More

Labels, Tags, Signage & Equipment, Printing & Duplicating Equipment, Electronic Components & Devices

Double Layer Stencil combines filling, inner-layer stages.

January 14, 2010

Suited for semiconductor applications and component manufacture, VectorGuard® Double Layer Platinum stencil is fabricated through 2-step lithography and Nickel electroforming process before mounted on VectorGuard tensioning technology. Mesh layer holds stencil intact while controlling flow of paste to second layer, and circuit layer determines thickness and shape of print deposits to deliver high-tolerance, fine-dimension printing with accuracy better than 0.1 µm/mm. Read More