Stencils

Stencils

FCT Assembly Offers More Than Stencils at the Ohio Expo & Tech Forum

GREELEY, CO — FCT Assembly today announced that it will exhibit at the Ohio SMTA Expo Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland – Independence. Greg Smith, Regional Sales Manager and Technical Support, and Larry Roy of Enterprise Electronic Sales will be on site to answer any questions about FCT's stencils and its new coating technology. In addition to...

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Stencils

FCT Assembly Brings New Stencils & Coating Technology to SMTA Dallas & Houston Expos

GREELEY, CO — FCT Assembly today announced plans to exhibit at the SMTA Dallas and SMTA Houston Expos. The SMTA Dallas Expo is scheduled to take place March 4, 2014 at the Plano Center in Plano, TX, and the SMTA Houston Expo will take place March 6, 2014 at the Stafford Centre in Stafford, TX. FCT Assembly has two stencil facilities in Texas, located in Richardson and Austin, making it easy for...

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Stencils

Solder Paste Stencil is available for custom stencil designs.

Able to be applied to existing production stencils, chemistry of NanoSlic® Gold coating imparts hydrophobic and oleophobic surface to apertures and underside of stencil; non-stick surface resists solder paste build-up and reduces cleaning cycle requirements. Â- Nano coating permanently bonds and conforms to aperture walls regardless of size or geometry. Abrasion surface withstands...

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Stencil for Solder Paste Printing increases yield, reduces waste.
Stencils

Stencil for Solder Paste Printing increases yield, reduces waste.

Developed to address electronic assembly industry demands, NanoSlic® Gold stencil features coating based on application process that coats both underside of stencil and aperture walls. Thermally cured and permanent coating is hydrophobic and oleophobic, which repels solder paste. Minimizing rework while increasing yields, properties promote solder paste transfer efficiencies for small...

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Printing Screens

DEK Solar Helps Break New Barriers for Low-Cost, High-Efficiency Solar Cells

Building on earlier work conducted in conjunction with the Institute for Solar Energy Research Hamelin (ISFH), DEK Solar has further optimized its Dual Print stencils and screens to push past previous industry cost and cell efficiency benchmarks. In the company’s latest project with ISFH, a record 20.2% cell efficiency on a PERC solar cell has been achieved via a Dual Print process with a...

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Stencils

Printing Intelligence Capability Raises the Bar

See the Latest DEK Advances at SMTA International At next month's SMTA International event in Fort Worth, Texas, DEK will show visitors how its intelligent printing technology can help raise yields, increase throughput and lower costs.Â-  With brand new products that enable parallel processing capability and minimal requirements for operator intervention, DEK is moving the industry...

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FCT Assembly to Demonstrate New Technology for Paste Printing during SMTAI
Stencils

FCT Assembly to Demonstrate New Technology for Paste Printing during SMTAI

GREELEY, COÂ- — FCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. NanoSlic™ is the world’s most advanced stencil technology for solder paste printing. The new NanoSlic™ stencil is based on the proven Slic™...

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Growing CM in the Northwest Chooses FCT Assembly for Its Stencil and Solder Paste Needs
Stencils

Growing CM in the Northwest Chooses FCT Assembly for Its Stencil and Solder Paste Needs

GREELEY, COÂ- - FCT Assembly today announced that it has secured an order from a fast-growing contract manufacturer (CM) in the Northwest. After thorough evaluations, an order was placed for FCT’s DEK VectorGuard® stencil system and NL932 no-clean, lead-free, halide-free solder paste. As a provider of quick-turn, 24-hour prototype and medium-volume production, the CM was in need of...

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Stencils

Fine Line Stencil helps maximize solar cell efficiency.

Ensuring printed line height uniformity, Fine Line Stencil™ enables sub-40 Â-µm line widths with no increase in line resistance. When used in dual print process, stencil first prints busbars with fine mesh screen, and then separately prints conductors. This allows optimized paste to be used for each process which not only gives precise control over print height of busbars and fine lines,...

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