Product News: Laboratory and Research Supplies & Equipment
Wafer Inspection System detects defects on all surfaces.
Press Release Summary:
May 2, 2012 - Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.
Original Press Release
KLA-Tencor Announces New CIRCL(TM) Suite
Press release date: April 23, 2012
-- Low percentage of non-critical defects, allowing engineers to quickly and accurately disposition production material;
-- Reticle ID check, to verify that the correct reticle was used for printing;
-- Macro overlay error monitoring, to check layer-to-layer pattern registration;
-- Inspection for defects on the wafer back side, where particles and scratches can potentially affect printed pattern dimensions on the front side of the wafer;
-- Detection and binning of edge defects, which can migrate to the die area and cause yield loss;
-- Edge Bead Removal (EBR) metrology, for monitoring film concentricity and edge integrity to ward off possible delamination defects;
-- Calibrated, automated edge profile measurements, to identify excursions that can result in water bead leakage or film delamination during immersion lithography; and
-- Automated high-resolution optical defect review and automated classification of front-side, back-side and edge defects, helping engineers identify the defect source quickly. The modules comprising the CIRCL suite can be matched to like modules in other CIRCL tools, to facilitate flexible routing of work in progress and to promote baseline stability. To maintain high performance and productivity, CIRCL cluster tools are backed by KLA-Tencor's global, comprehensive service network. CIRCL modules have been shipped to leading foundry, logic and memory chip manufacturers for use in advanced development and production lines. For more information on KLA-Tencor's CIRCL cluster tools, please visit the product web pages at: www.kla-tencor.com/front-end-defect-inspection/CIRCL.html. About KLA-Tencor:
KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, data storage, LED, photovoltaic, and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com (KLAC-P). Web Site: www.kla-tencor.com