KLA-Tencor Corp.
Milpitas, CA 95035
KLA Introduces Two New Systems That Take on Semiconductor Manufacturing's Toughest Problems
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Milpitas, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of...
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New eSL10 E-Beam Defect Inspection System Employs Deep Learning Algorithms
Features electron optics design that produces widest operating range for defect capture across variety of process layers and device types. Offers Yellowstone™ scanning mode that uses 10 billion pixels of information per scan to support high speed operation. Simul-6™ sensor technology collects surface, topographic, material contrast and deep trench information in one scan.
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New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications
Available in Archer™ 750 overlay and SpectraShape™ 11k optical critical dimension models. Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the presence of process variation. SpectraShape 11k CD and dimensional shape metrology system provides sensitivity and productivity that accommodates materials, structures and wafer shapes.
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New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.
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KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection
The Kronos™ 1080 System comes with a higher-density metal patterns and multi-layer redistribution layers. It features multi-mode optics, sensors and advanced defect detection algorithms and is suitable for mobile, networking and high-performance computing applications. The ICOS™ F160 system is used in the detection of laser-groove, hairline and sidewall cracks and allows user to change input...
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KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies
Comprehensive Process Control Facilitates Advanced Multi-Patterning Techniques and EUV Lithography MILPITAS, Calif., Feb. 22, 2017 - KLA-Tencor Corporation (NASDAQ: KLAC) today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices: the Archer™ 600 overlay metrology system, the WaferSight™ PWG2 patterned...
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Reticle Inspection Systems qualify masks 10 nm and below.
Utilizing Dual Imaging technology, Teron™ 640 offers sensitivity necessary to accurately qualify advanced optical masks. Teron™ SL655 with STARlightGold™ technology helps IC manufacturers assess incoming reticle quality, monitor reticle degradation, and detect yield-critical reticle defects. Measurements produced by Teron models are supported by Reticle Decision Center, a data analysis and...
Read More »Wafer Defect Inspection/Review Systems aid IC device manufacture.
Employing diverse technologies, 3900- and 2930 Series broadband plasma optical inspectors, Puma™ 9980 laser scanning inspector, CIRCL™5 all-surface inspection cluster, Surfscan-® SP5XP unpatterned wafer inspector, and eDR7280™ e-beam review and classification tool form wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC manufacturing....
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Inspection System supports advanced semiconductor packaging.
Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS-® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems...
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KLA-Tencor Extends Its 5D(TM) Patterning Control Solution with New Metrology Systems
Comprehensive Overlay and Films Process Control Solutions Address Advanced IC Process Challenges MILPITAS, Calif.- — Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer™ 500LCM and SpectraFilm™ LD10. The Archer 500LCM overlay metrology system provides accurate overlay error...
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KLA Introduces Two New Systems That Take on Semiconductor Manufacturing's Toughest Problems
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Milpitas, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of...
Read More »
New eSL10 E-Beam Defect Inspection System Employs Deep Learning Algorithms
Features electron optics design that produces widest operating range for defect capture across variety of process layers and device types. Offers Yellowstone™ scanning mode that uses 10 billion pixels of information per scan to support high speed operation. Simul-6™ sensor technology collects surface, topographic, material contrast and deep trench information in one scan.
Read More »KLA Launches Electronics, Packaging and Components Group
New Business Group Targets Growth Opportunities in Fast-Growing Sectors MILPITAS, Calif., May 26, 2020 /PRNewswire/ -- KLA Corporation (NASDAQ: KLAC) today announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Under the leadership of KLA Executive Vice President Oreste Donzella, the EPC group extends KLA's leadership...
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New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications
Available in Archer™ 750 overlay and SpectraShape™ 11k optical critical dimension models. Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the presence of process variation. SpectraShape 11k CD and dimensional shape metrology system provides sensitivity and productivity that accommodates materials, structures and wafer shapes.
Read More »
New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.
Read More »KLA Receives Intel's Preferred Quality Supplier Award
MILPITAS, Calif., March 27, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) is proud to announce that the company has received the Intel 2018 Preferred Quality Supplier (PQS) award, with Distinguished Performance in Safety, for its process control capital equipment and services. Intel's award-winning suppliers are critical to Intel's success, said Jacklyn Sturm, corporate vice...
Read More »KLA Completes Acquisition of Orbotech Ltd.
MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). We are very pleased to have completed the acquisition of Orbotech, said Rick Wallace, president and CEO of KLA. This new combination extends KLA's market reach within the electronics value chain, opens new high-growth markets...
Read More »KLA-Tencor Announces Plans to Establish R&D Facility in Ann Arbor, Michigan
MILPITAS, Calif., Oct. 24, 2018 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) has announced plans to establish a research-and-development (R&D) center in Ann Arbor, Michigan. The development is expected to include a total capital investment of more than $70 million and create up to 500 new high-tech jobs in the region over the next five years. Logo...
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KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection
The Kronos™ 1080 System comes with a higher-density metal patterns and multi-layer redistribution layers. It features multi-mode optics, sensors and advanced defect detection algorithms and is suitable for mobile, networking and high-performance computing applications. The ICOS™ F160 system is used in the detection of laser-groove, hairline and sidewall cracks and allows user to change input...
Read More »
KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies
Comprehensive Process Control Facilitates Advanced Multi-Patterning Techniques and EUV Lithography MILPITAS, Calif., Feb. 22, 2017 - KLA-Tencor Corporation (NASDAQ: KLAC) today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices: the Archer™ 600 overlay metrology system, the WaferSight™ PWG2 patterned...
Read More »