KLA-Tencor Corp.
Milpitas, CA 95035
New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.
Read More »KLA-Tencor(TM) and TEL Announce New SpectraShape(TM) Dimensional Metrology Systems With AcuShape(TM)2 Next-Generation Modeling Capability
For Characterization and Production Monitoring of Geometrically Complex Structures of High-Performance Integrated Circuits MILPITAS, Calif. - Today KLA-Tencor Corporation(TM) (Nasdaq: KLAC) announced the SpectraShape(TM) 8660 and 8810 dimensional metrology systems, featuring AcuShape(TM)2 modeling software developed jointly with Tokyo Electron Limited (TEL). The new SpectraShape tools are able to...
Read More »Packaged IC Component Inspector features dual taper output.
ICOSÃ-® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 Ã-µm, unit can also capture surface defects down to 40 Ã-µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.
Read More »Metrology System measures multi-layer film thickness.
Suited for production monitoring of critical gate applications on product wafers and 45/32 nm development, Aleris 8500 combines composition and multi-layer film thickness metrology. It is built on SpectraFx 200 technology featuring 150 nm Broadband Spectroscopic Ellipsometry (BBSE(TM)) optics. Single-tool solution comes with StressMapper(TM) module that provides high spatial resolution for...
Read More »Wafer Inspection System handles 65 nm and 45 nm nodes.
Puma 91xx Series darkfield inspection system incorporates Streak(TM) multi-pixel sensor and line scanning technologies to achieve high-resolution darkfield imaging inspection. Suited for DRAM, SRAM, Flash, and logic devices, system utilizes Fast Adaptive Single Threshold (FAST) algorithm for reducing number of parameters needed to create and tune tool recipes. Inline Defect Organizer(TM) enables...
Read More »Surface Analyzer measures roughness and micro-waviness.
With spatial bandwidth coverage from 0.22-2,000 microns and noise floor below 0.5 angstroms, Candela Optical Surface Analyzer 6300 Series delivers metrology and inspection capabilities for data storage substrates and finished media in both radial and circumferential directions. Multi-channel optics, combined with laser stability management technology, delivers measurement capabilities for edge...
Read More »KLA-Tencor Enables Production Monitoring for High-Brightness LED Market with New Automated Wafer Inspection System
SAN JOSE, Calif., Nov. 9 / -- KLA-Tencor (NASDAQ:KLAC) today introduced the Candela CS20 -- the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for...
Read More »Analyzer facilitates lithography cell qualification.
Integrated with Archer overlay, eCD CD SEM, and SpectraCD optical CD metrology platforms for 65 nm and below IC production, K-T Analyzer lithography correctable platform provides automated, on-tool analysis of overlay and critical dimension metrology data in real time. System gives engineers immediate feedback on quality of lithography process, enabling them to correct errors, minimize...
Read More »Photomask Inspection System works at and below 65 nm node.
STARlight-2(TM) provides wafer fabs with contamination inspection solution for all types of photomasks, including mainstream extreme resolution enhancement technique photomasks. With inspection capabilities designed for detection of progressive defects, product features 90 and 125 nm pixel sizes that provide resolution and sensitivity needed to detect mask contaminants on device layers with...
Read More »Inspection System finds defects in wafers and process tools.
Providing simultaneous brightfield and darkfield inspection channels, Viper 2435 Automated Dispositioning System detects broad range of critical defects at sampling rates up to 100 wafer/hr. Using tool at lithography, CMP, etch, and film modules, fab can flag wafers with defects that require corrective action, while bypassing wafers having nuisance defects. Viper 2435 integrates with...
Read More »KLA Launches Electronics, Packaging and Components Group
New Business Group Targets Growth Opportunities in Fast-Growing Sectors MILPITAS, Calif., May 26, 2020 /PRNewswire/ -- KLA Corporation (NASDAQ: KLAC) today announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Under the leadership of KLA Executive Vice President Oreste Donzella, the EPC group extends KLA's leadership...
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New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.
Read More »KLA Receives Intel's Preferred Quality Supplier Award
MILPITAS, Calif., March 27, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) is proud to announce that the company has received the Intel 2018 Preferred Quality Supplier (PQS) award, with Distinguished Performance in Safety, for its process control capital equipment and services. Intel's award-winning suppliers are critical to Intel's success, said Jacklyn Sturm, corporate vice...
Read More »KLA Completes Acquisition of Orbotech Ltd.
MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). We are very pleased to have completed the acquisition of Orbotech, said Rick Wallace, president and CEO of KLA. This new combination extends KLA's market reach within the electronics value chain, opens new high-growth markets...
Read More »KLA-Tencor Announces Plans to Establish R&D Facility in Ann Arbor, Michigan
MILPITAS, Calif., Oct. 24, 2018 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) has announced plans to establish a research-and-development (R&D) center in Ann Arbor, Michigan. The development is expected to include a total capital investment of more than $70 million and create up to 500 new high-tech jobs in the region over the next five years. Logo...
Read More »KLA-Tencor Announces Termination Of Merger Agreement With Lam Research
MILPITAS, Calif., Oct. 5, 2016Ã- - KLA-Tencor Corporation (NASDAQ: KLAC) (the Company ) and Lam Research Corp. (NASDAQ: LRCX) today announced that they have agreed to terminate their proposed merger agreement. The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice (the DOJ ) advised...
Read More »KLA-Tencor(TM) and TEL Announce New SpectraShape(TM) Dimensional Metrology Systems With AcuShape(TM)2 Next-Generation Modeling Capability
For Characterization and Production Monitoring of Geometrically Complex Structures of High-Performance Integrated Circuits MILPITAS, Calif. - Today KLA-Tencor Corporation(TM) (Nasdaq: KLAC) announced the SpectraShape(TM) 8660 and 8810 dimensional metrology systems, featuring AcuShape(TM)2 modeling software developed jointly with Tokyo Electron Limited (TEL). The new SpectraShape tools are able to...
Read More »Packaged IC Component Inspector features dual taper output.
ICOSÃ-® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 Ã-µm, unit can also capture surface defects down to 40 Ã-µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.
Read More »KLA-Tencor(TM) Announces Live Webcast Participation at Upcoming Investor Conferences
MILPITAS, Calif., Feb. 3, 2011 - KLA-Tencor Corporation(TM) (Nasdaq: KLAC), the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, today announced that the company will provide live audio webcasts from the following upcoming investor conferences: o Feb. 11, 2011-Stifel Nicolaus, 2011 Technology, Communications and Internet...
Read More »KLA-Tencor Announces Live Webcast of Investor Presentation at the Barclays Capital 2010 Global Technology Conference
MILPITAS, Calif., Dec. 1, 2010 -- KLA-Tencor Corporation (Nasdaq: KLAC), the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, today announced that the company will provide a live audio webcast of its investor presentation at the Barclays Capital 2010 Global Technology Conference on Wednesday, Dec. 8, 2010 at 2:30 p.m. Pacific...
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