Product News: Electronic Components & Devices
UVC and UVB LEDs are available in SMD format.
Press Release Summary:
February 20, 2013 - Offering peak operating wavelengths of 275 and 310 nm, UVTOP® LEDs are available in surface-mount packages for high-volume, cost-sensitive markets. Ceramic package measures 3.5 x 3.5 mm and is available with UV-stable encapsulation, flat glass window, or hemispherical glass window; windowless devices are also available. TO packages are available for lower-volume requirements, customized specifications, and those who prefer through-hole package.
Original Press Release
UVTOP® UVC and UVB LEDs Now Available in SMD Format
Press release date: February 15, 2013
COLUMBIA, S.C. – Sensor Electronic Technology, Inc. (SETi) has launched a new line of UVTOP® products in surface mount packages at the 2013 SPIE Photonics West show. Initial devices added to this product line will operate with peak operating wavelengths at 275nm and 310nm respectively. Additional wavelength specifications will be added to the product line in the near future.
This SMD based line of UVTOP® LEDs has been developed to address high volume markets that demand lower device and assembly costs.
The ceramic package dimensions are 3.5mm x 3.5mm and are available with UV stable encapsulation, a flat glass window, or a hemispherical glass window. Windowless devices are also available.
The entire range of UVTOP® LEDs will remain available in TO packages for lower volume requirements, customized specifications and for customers who prefer a through-hole package.
In 2012, SETi opened its high volume manufacturing facility for UV LEDs, driving the cost of manufacture down and now by employing new high volume packaging techniques and with the use of this cost effective ceramic package, SETi is bringing the world leading UVTOP® LEDs to new mass-volume markets where the TO package is not the most effective solution.
For more information and for technical specifications, please contact SETi at email@example.com or on +1 (803) 647-9757.