Product News: Adhesives & Sealants
Thermally Conductive PSA Tape handles solder reflow heat.
Press Release Summary:
July 19, 2010 - Bond-Ply 450 PA features backside release liner capable of withstanding extreme heat of solder reflow while maintaining adhesion and release characteristics for facilitated application. Un-reinforced, pressure sensitive adhesive (PSA) tape maintains bond strength to various low-energy surfaces, including aluminum heat sinks and plastics, with long-term exposure to high heat and humidity. Pre-application to Thermal CladÂ® substrate allows tape to be punched to exact dimensions of board.
Original Press Release
New Bond-Ply® 450 PA Offers a Pre-Applied Thermal Management Solution that can Withstand the Heat of Solder Reflow
Press release date: July 16, 2010
CHANHASSEN, MN - The Bergquist Company introduces the first in an innovative new line of pre-applied thermal interface materials to Thermal Clad substrates. Bond-Ply 450 PA is an un-reinforced, thermally conductive pressure sensitive adhesive tape and is the first of many pre-applied offerings to come. Previously, high temperatures associated with solder reflow prevented the application of adhesives prior to board population. Bond-Ply 450 PA features a backside release liner capable of withstanding the extreme heat of solder reflow while maintaining adhesion and release characteristics for easy application.
Bond-Ply 450 PA achieves superior adhesion performance and surface "wet-out". The material is designed to maintain high bond strength to a variety of "low energy" surfaces, including aluminum heat sinks and many plastics, with long term exposure to high heat and humidity. The pre-application of Bond-Ply 450 PA to a Thermal Clad substrate allows it to be punched to the exact dimensions of the board, eliminating the need for future labor intensive hand placement. Typical applications for Bond-Ply 450 PA include Bergquist manufactured LED T-Clad circuit boards, motor control boards, LED boards and rails.
Bond-Ply 450 PA is offered in a standard 5 mil thickness featuring a 6 mil paper release liner. The material is exclusively available pre-applied to Bergquist Thermal Clad substrates. Thermal Clad offerings include scored array circuits, scored cingulated circuits and punched cingulated parts. Thermal Clad LED standard stars and squares are also available with Bond-Ply 450 PA. For pricing or immediate technical information, please visit www.bergquistcompany.com or call 1-800-347-4572 and ask for a Sales Representative.
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating Gap Fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.