The Bergquist Company, a Henkel Company

Materials

Phase Change Material offers optimized handling, dispensability.

Suited for use between high-power electrical device requiring electrical isolation and its heat sink, Hi-Flow® 650P thermally conductive phase change material offers thermal impedance of 0.20Â-ºC-in.²/W at 25 psi. Top side is dry to touch, bottom side has natural tack, and polyimide film reinforcement provides dielectric strength as well as cut-through resistance. Appropriate...

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Materials

Thermal Interface Material has highly conformable, elastic nature.

Gap Pad® VO Ultimate is fiberglass reinforced, silicone-based material that is suitable for use on surfaces with high roughness or uneven topography. Fiberglass carrier on one side offers optimal puncture resistance, and has slight inherent tack, minimizing any shifting during assembly. Available in standard sheet size of 8 x 16 in. and thicknesses of 20-125 mil, conformable, elastic...

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Materials

Phase Change Material provides natural tack.

Featuring thermal impedance of 0.17°C-inÂ-²/W at 50 psi, Hi-Flow® 330P is suited for use between high-power electrical device requiring electrical isolation and its heat sink. With polyimide film reinforcement, top side is dry and bottom side has natural tack. Material is available in standard roll size of 11 in. by 250 ft and comes in thicknesses of 0.0045, 0.0050, and 0.0055...

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Electronic Components & Devices

HPL Dielectric Material delivers superior heat transfer.

At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower...

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Adhesives & Sealants

Thermally Conductive PSA Tape handles solder reflow heat.

Bond-Ply 450 PA features backside release liner capable of withstanding extreme heat of solder reflow while maintaining adhesion and release characteristics for facilitated application. Un-reinforced, pressure sensitive adhesive (PSA) tape maintains bond strength to various low-energy surfaces, including aluminum heat sinks and plastics, with long-term exposure to high heat and humidity....

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Gap Filler offers high slump resistance.
Adhesives & Sealants

Gap Filler offers high slump resistance.

Two-component Gap Filler 1500 is silicone based liquid solution suitable for filling unique and intricate air voids and gaps in applications requiring thermally conductive vibration dampening. High shear thinning characteristics support optimized control during dispensing, which can be manual or automatic. Providing 1.8 W/m-K thermal performance, material is dry when cured. It is available in 50...

Read More »
Materials

Phase Change Material offers optimized handling, dispensability.

Suited for use between high-power electrical device requiring electrical isolation and its heat sink, Hi-Flow® 650P thermally conductive phase change material offers thermal impedance of 0.20Â-ºC-in.²/W at 25 psi. Top side is dry to touch, bottom side has natural tack, and polyimide film reinforcement provides dielectric strength as well as cut-through resistance. Appropriate...

Read More »
Materials

Thermal Interface Material has highly conformable, elastic nature.

Gap Pad® VO Ultimate is fiberglass reinforced, silicone-based material that is suitable for use on surfaces with high roughness or uneven topography. Fiberglass carrier on one side offers optimal puncture resistance, and has slight inherent tack, minimizing any shifting during assembly. Available in standard sheet size of 8 x 16 in. and thicknesses of 20-125 mil, conformable, elastic...

Read More »
Materials

Phase Change Material provides natural tack.

Featuring thermal impedance of 0.17°C-inÂ-²/W at 50 psi, Hi-Flow® 330P is suited for use between high-power electrical device requiring electrical isolation and its heat sink. With polyimide film reinforcement, top side is dry and bottom side has natural tack. Material is available in standard roll size of 11 in. by 250 ft and comes in thicknesses of 0.0045, 0.0050, and 0.0055...

Read More »
Electronic Components & Devices

HPL Dielectric Material delivers superior heat transfer.

At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower...

Read More »
Adhesives & Sealants

Thermally Conductive PSA Tape handles solder reflow heat.

Bond-Ply 450 PA features backside release liner capable of withstanding extreme heat of solder reflow while maintaining adhesion and release characteristics for facilitated application. Un-reinforced, pressure sensitive adhesive (PSA) tape maintains bond strength to various low-energy surfaces, including aluminum heat sinks and plastics, with long-term exposure to high heat and humidity....

Read More »
Gap Filler offers high slump resistance.
Adhesives & Sealants

Gap Filler offers high slump resistance.

Two-component Gap Filler 1500 is silicone based liquid solution suitable for filling unique and intricate air voids and gaps in applications requiring thermally conductive vibration dampening. High shear thinning characteristics support optimized control during dispensing, which can be manual or automatic. Providing 1.8 W/m-K thermal performance, material is dry when cured. It is available in 50...

Read More »

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