ATR Format Enclosures have conduction-cooled design.
Press Release Summary:
Available for both OpenVPX and MicroTCA architectures, conduction-cooled ATR format chassis comes in ½ and ¾ sizes for 3U or 6U boards. Options are also available for MicroTCA.3 Hardened form factor as well as heat exchanged versions. Designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461, products are also available with power interface boards for incorporating VITA 62 or PICMG 2.9 power supplies. For SWaP-optimized designs, SFF conduction-cooled solutions are available.
Original Press Release:
New Conduction Cooled Enclosures from Pixus Technologies
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs. Enclosures formats are available for both OpenVPX and MicroTCA architectures.
The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards. There are also options for the MicroTCA.3 Hardened form factor as well as heat exchanged versions. The enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. Off-the-shelf power interface boards are available to easily incorporate VITA 62 or PICMG 2.9 power supplies. For specialty designs or those looking to minimize Size, Weight, and Power (SWaP), Pixus also offers application-specific conduction cooled solutions.
Pixus provides rugged and 19” rackmount enclosures in multiple backplane architectures including OpenVPX, MicroTCA, AdvancedTCA, and legacy CompactPCI/VME. The company also provides specialty backplanes and handle/panel sets for embedded boards.
