Wire Bonders include programmable power supply system.
March 25, 2008 -
With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd.
Willow Grove, PA, 19090
USA
Kulicke & Soffa Introduces Next-Generation Wire Bonders at SEMICON China
Fort Washington, PA-March 17, 2008 - Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) ("K&S") introduces two next-generation wire bonders at SEMICON China, in Shanghai. The first is the new IConnPS High Performance Wire Bonder, which will replace the current market-leading Maxumultra. The name IConnPS comes directly from its function of IC inter-Connect. It offers the highest performance in wire bond packaging assembly, with features that address the advanced product roadmaps of K&S customers including:
o ± 2.0µm accuracy for sub-35µm ultra fine pitch requirements
o New advanced looping processes
o Automatic Self-Teaching Bond Integrity Test System (Auto BITS)
o Programmable Focus Optics for complex stacked die packages
The second bonder being announced is the new ConnXPS High Speed Wire Bonder, which replaces the Maxumelite. The ConnXPS is engineered to provide unsurpassed throughput for manufacturing lower pin count ICs and LEDs, in the Cost Performance part of the assembly market. Its features include:
o ±3.0µm accuracy
o Look ahead vision algorithms to align and bond simultaneously
o Programmable Red/Blue Illumination
The PS superscript in both these Wire Bonders means they will be part of the Company's new Power Series product line. This series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market. The Power Series will also be represented by a new product line symbol - a form of the Chinese Character "Li", which means Power and Strength throughout Asia.
Common features for both the IConnPS and ConnXPS include:
o Larger 80mm Bondable Area and Advanced Motion Control System
o Dual Frequency Transducer
o Programmable Power Supply System
Scott Kulicke, Chairman and CEO of K&S, explains that, "These next generation wire bonders are the most thoroughly tested products in our history, so they are ready for production right out of the box. In addition to the accuracy, looping, and reliability tests, we ran customers' Maxumultra bond programs directly on IConnPS with excellent results. We confirmed the bonding and looping quality at the increased speed."
The customer qualification process for the two Power Series wire bonders started this quarter, and will be followed by initial production shipments to customers in the June quarter.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor assembly equipment, materials, and technology. K&S provides wire bonders, capillaries, wire, die bonders, and die collets for all types of semiconductor packages using wire as the internal electrical interconnections. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor assembly equipment along with the complementing packaging materials and process technology that enable our customers to achieve the highest possible yields and throughput. The ability to provide these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is http://www.kns.com.
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