Bonders

Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic Components

Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic Components

Ultrasonic Metal Welding Capabilities to be on Display at the May 2016 National Wire Processing Expo WEST CHESTER, Pennsylvania – Sonobond Ultrasonics’ metal welding technology is keeping pace with the growing number of increasingly complex electronic components used in automotive and other circuitry.Â-  The company even offers wire-to-terminal welders that produce single point ground...

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Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA

Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA

Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The NetherlandsÂ- – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson...

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Sonobond Ultrasonics Celebrates the Resurgence in U.S. Manufacturing Sector

Sonobond Ultrasonics Celebrates the Resurgence in U.S. Manufacturing Sector

US-Made Ultrasonic Metal Welding Machines Offer Manufacturers Increased Productivity and Efficiency WEST CHESTER, Pennsylvania – Sonobond Ultrasonics has been buttressing what some analysts expect will be a resurgence in U.S. manufacturing.Â-  Our faith in the U.S.A. as a manufacturing base has never wavered, says Sonobond President Janet Devine.Â-  She adds that despite the domestic...

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Sonobond's Ultrasonic Bonding Technology Increasingly Essential for Ensuring Reliable Body Armor Assembly

More than 30 Leading Manufacturers Use Sonobond Equipment to Achieve Improved Production Speed, Product Durability, Cost-Effectiveness and Compliance with Tough NIJ Standards WEST CHESTER, Pennsylvania — With armed services personnel, emergency responders, law enforcement officers, and others exposed to more and more perilous circumstances, reliable body armor is absolutely essential for their...

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Wafer Bonding Systems support wafers up to 200 mm in diameter.

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVGÂ-®580 ComBondÂ-® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with...

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EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

EVGÂ-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for...

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BriskHeat Selected Again to Supply Out-of-Autoclave Composite Heating Solution

Columbus,OH –Â- BriskHeat Corporation's configurable heating system has been selected again by another major aerospace industry Original Equipment Manufacturer for an out-of-autoclave composite curing solution. This is the second customer to choose BriskHeat for composite curing in the past three months. BriskHeat's out-of-autoclave heating system is capable of providing precise and uniform...

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Sonobond's Free, No-Obligation Ultrasonic Bonding Viability Test Helps Companies Find Practical, Cost-Effective Solutions for Their Textile and Filtration-Assembly Applications

Sonobond's Free, No-Obligation Ultrasonic Bonding Viability Test Helps Companies Find Practical, Cost-Effective Solutions for Their Textile and Filtration-Assembly Applications

Sample ultrasonic bonds are made using materials supplied by prospective customers.Â-  Sonobond then recommends the appropriate ultrasonic bonding equipment to match each firm’s specific needs and requirements. WEST CHESTER, PA - Janet Devine, President of Sonobond Ultrasonics, announced today that the company's free Ultrasonic Bonding Viability Test is proving to be very important to firms...

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Sonobond's Ultrasonic Assembly Capabilities for Nonwoven Applications will be on Display at IDEA 2013 in Miami Beach, Florida

Attendees will see the SeamMaster™ High Profile Ultrasonic Bonder and SureCut™ 35 Ultrasonic Cutter at Booth #1371. They can also view a new multi-media presentation featuring Sonobond machines in action and showing the wide variety of products assembled using this ultrasonic equipment. WEST CHESTER, Pennsylvania — Janet Devine, President of Sonobond Ultrasonics, announced today that the...

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