New EZ09 Hot Bonder for Smart Patch Repair Bonding in Field
Features a large touch-screen display panel and sophisticated software. Designed for the repair of high-performance aircraft structures. Composite repair kit contains the necessary tools for composite repair on an advanced carbon structure.
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New EZ09 Hot Bonder for Smart Patch Repair Bonding in Field
Features a large touch-screen display panel and sophisticated software. Designed for the repair of high-performance aircraft structures. Composite repair kit contains the necessary tools for composite repair on an advanced carbon structure.
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EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...
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EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...
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What Affects the Price of Electronics Manufacturing?
The eBook provides an overview of designing for manufacturability, exploring what it means and discussing what to do to design costs out of electronic manufacturing projects.
Read More »MRSI Systems Introduces MRSI-HVM3P Equipped with Inline Conveyor for Single Fixture or Multiple Cassette Inputs
The new MRSI-HVM3P is an extension to its existing high-speed MRSI-HVM3 die bonder platform. The bonder offers configuration for active optical cable (AOC), gold-box packaging, chip-on-carrier (CoC) and other applications. The processes include eutectic, epoxy stamping, UV epoxy dispensing and in-situ UV curing. The bonders are equipped with inline conveyors to transport large forms of carriers...
Read More »MRSI Systems Introduces MRSI-HVM3P Equipped with Inline Conveyor for Single Fixture or Multiple Cassette Inputs
The new MRSI-HVM3P is an extension to its existing high-speed MRSI-HVM3 die bonder platform. The bonder offers configuration for active optical cable (AOC), gold-box packaging, chip-on-carrier (CoC) and other applications. The processes include eutectic, epoxy stamping, UV epoxy dispensing and in-situ UV curing. The bonders are equipped with inline conveyors to transport large forms of carriers...
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UV / VISIBLE / LED Curable Multi-Substrate (Plastics) General Bonder
High Clarity, Cures Tack-Free, Medium Viscosity Bonder Incure Uni-Weld 1924 UV / Visible / LED curable adhesive is an acid-free, multi-substrate medium viscosity bonder. High in clarity and cures tack-free, it is an excellent choice for applications requiring good bonding strength of 2,700 to 5,700 PSI on multiple substrates such as metals, glass, plastics, FR4 materials on a single application....
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UV / VISIBLE / LED Curable Multi-Substrate (Plastics) General Bonder
High Clarity, Cures Tack-Free, Medium Viscosity Bonder Incure Uni-Weld 1924 UV / Visible / LED curable adhesive is an acid-free, multi-substrate medium viscosity bonder. High in clarity and cures tack-free, it is an excellent choice for applications requiring good bonding strength of 2,700 to 5,700 PSI on multiple substrates such as metals, glass, plastics, FR4 materials on a single application....
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Universal's Flexbond Wins Global Technology Award at SMTA International
Unique architecture enables the first true volume solution for today’s consumer demands. Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and...
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Universal's Flexbond Wins Global Technology Award at SMTA International
Unique architecture enables the first true volume solution for today’s consumer demands. Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and...
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Dodge® Raptor Coupling Now Available in Three Larger Sizes
The Dodge Raptor coupling epitomizes the innovation and value that has made Baldor a world leader in industrial electric motors. For almost 100 years Baldor has been the go-to source for industries across the globe. The Raptor coupling is just one example of our dedication to engineered excellence and commitment to providing value and performance. See our video to learn more.
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