ULP Computer-on-Module fosters enhanced SFF system development.
February 25, 2013 -
Helping embedded OEMs develop ULP SFF (ultra-low power small form factor) solutions, ULP-COM-sA3874i provides scalable building block suited for space-constrained, fanless, and harsh environment applications. COM leverages single-core ARM Cortex A8 technology performance based on TI AM3874 Sitara ARM processors; offers diverse interface, storage, and networking capabilities; and supports 3D graphics acceleration and HD video processing as well as dual independent displays.
|Original Press Release |
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Kontron Helps Reduce Costs of Ultra-Low Power SFF Systems with Latest Texas Instruments-Based ULP-COM Computer-on-Modules
Offering extremely low TDP, Kontron’s expanded ULP-COM portfolio gives developers an ideal building block solution for space-constrained, harsh environment applications
Eching/Nuremberg, Germany – Kontron today introduced its latest ULP-COM standards-based Computer-on-Modules to help embedded OEMs drive down system costs for ultra-low power SFF (small form factor) solutions. Kontron’s expanded ULP-COM portfolio is designed as a highly scalable building block for the swift and cost-effective development of energy-efficient mobile devices. Featuring an extremely low TDP (Thermal Design Power), the Kontron ULP-COM-sA3874i is well-suited for space-constrained, fanless and harsh environment applications. Offering single core ARM Cortex A8 technology performance based on Texas Instrument’s AM3874 Sitara ARM processors, Kontron’s latest ULP-COM module delivers the computing power required by the diverse range of smart devices being designed today in an exceptionally small 82 mm x 50 mm footprint.
The Kontron ULP-COM-sA3874i module supports an extended operating temperature range of -40°C to +85°C and expands the scalable Computer-on-Module building block model to a broader range of SFF systems that must operate in harsh environmental conditions such as those in the military, industrial automation/HMI, digital signage and medical markets. Support for Android, Linux, WEC7, and additionally a variety of real-time operating systems on project request, enables embedded OEMs to leverage an active ecosystem of development partners.
“Texas Instrument’s AM3874 processor is an excellent ARM-based platform for Kontron’s ULP-COM ultra-low power module. It delivers outstanding value with single core performance that doesn’t compromise on graphics performance, which makes it well-suited for a broad variety of industrial, small form factor applications,” said Peter Peisker, European Director Embedded Processing Marketing & Applications at Texas Instruments.
The feature set in brief
The new Kontron ULP-COM-sA3874i Computer-on-Module family is available with the Texas Instruments Sitara single core Cortex-A8 technology-based microprocessors (MPUs) for the extended temperature range that offer performance up to 800 MHz. Kontron’s ULP-COM modules support 3D graphics acceleration and HD video processing. Dual independent displays are possible via parallel 18/24 bit LCD or 18/24 bit single-channel LVDS and HDMI. Additionally, the module supports a parallel camera interface input. The modules provide a x1 Gen 2 PCI Express lane and interface flexibility with 4-bit SDIO and SDMMC storage, SPI x2, I2S x4, I2C x4 for general purpose and CAN Bus x 2. Networking is supported by a 10/100/1000 Gigabit Ethernet port.
The Kontron ARM Cortex A8 ULP-COM-sA3874i module family is available for sampling now with serial production in Q1 2013.
For more information, please visit the Kontron ULP-COM-sA3874i product page
Kontron is a global leader in embedded computing technology. With more than 40% of its employees in research and development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.
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