Thermoelectric Module provides optoelectronic cooling.
December 17, 2009 -
Compatible with eutectic gold-tin solder, OptoCooler HV14 enables assembly temperatures as high as 320°C. At 85°C, unit operates at max of 2.7 V and can pump 1.7 W of heat in footprint of 3 mm². RoHS-compliant module can create temperature differential of up to 50°C between hot and cold sides, making it suited for cooling and temperature control of optoelectronic devices such as laser diodes, semiconductor optical amplifiers, and sensors.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Nextreme Thermal Solutions
3908 Patriot Drive, Suite 204
Durham, NC, 27003
USA
Nextreme Announces High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling
Gold-tin in the OptoCooler HV14 enables conformance to standard optoelectronic assembly processes...
DURHAM, N.C. - Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder - the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors.
The OptoCooler HV14 module is a high heat pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3mm². The module can create a temperature differential (ÄT) of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices such as laser diodes.
AuSn solder provides excellent joint strength, strain resistance and thermal conductivity. After the initial reflow during device assembly, the melting point of this particular AuSn solder is 320°C, enabling subsequent attachment of laser diodes and other devices to Nextreme's thermoelectric modules at lower temperatures, typically at 283°C, which is the industry standard. The use of this strain resistant material is particularly important for the laser diodes where movement of solder as little as 10 microns can cause significant alignment issues.
"Nextreme now offers the standard for solder assembly established by the optoelectronics industry," said Dr. Paul A. Magill, vice president of marketing and business development for Nextreme. "The introduction of gold-tin in the HV14 product line addresses our customers' most challenging assembly requirements."
The OptoCooler HV14 is RoHS compliant and is available for order now. Pricing is available upon request. More information on the OptoCooler family can be found at www.nextreme.com/optocooler.
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