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Pass-Through Drying Cabinet dehumidifies ICs.

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Pass-Through Drying Cabinet dehumidifies ICs.
Pass-Through Drying Cabinet dehumidifies ICs.
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March 5, 2014 - Offering alternative to baking, MBBs, and nitrogen storage, McDry DXU-401DP Pass Through Dry Cabinet dehumidifies ICs to prevent micro-cracking. Double-sided doors facilitate access on either side of SMT line, and multiple access doors let operators retrieve materials and replace them quickly and efficiently. Along with ESD Safe Design that adheres to IEC-61340-5-1 (ESD) Standard, Cabinet conforms to IPC/JEDEC J-STD 033C and IPC 1601 Standards.

Seika Introduces the McDry DXU-401DP Pass Through Dry Cabinet


Seika Machinery, Inc.
3528 Torrance Blvd Suite 100
Torrance, CA, 90503
USA



Press release date: February 1, 2014

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the new McDry DXU-401DP Pass Through Dry Cabinet.

The cabinet features double-sided doors for easy access on either side of the SMT line. Multiple access doors allow operators to retrieve materials and replace them in a quick and efficient manner.   The McDry manufacturer continues to develop dry cabinets that meet the demand and requirements of an increasingly time-sensitive market.

Like all of the McDry cabinets, the McDry DXU-401DP conforms to IPC/JEDEC J-STD 033C and IPC 1601Standards. Additionally, the ESD Safe Design adheres to IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and Nitrogen storage.

The DXU-401DP Pass Through Dry Cabinet will be displayed for the first time in Booth #2433 at the IPC APEX EXPO in Las Vegas from March 25-27, 2014. For more information, visit www.seikausa.com.

About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
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