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Negative I-Line Photoresist has hydrophobic cured chemistry.

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Negative I-Line Photoresist has hydrophobic cured chemistry.
Negative I-Line Photoresist has hydrophobic cured chemistry.
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June 25, 2013 - With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance to moisture and corrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165°C and moderate modulus of 4.5 GPa at 25°C. NR series comes in solids/viscosities that achieve 2–40 µm thickness in single layer.

Engineered Material Systems Develops NR-2500 Spin Coatable Negative I-Line Photoresist


(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Engineered Material Systems
132 Johnson Dr.
Delaware, OH, 43015
USA



Press release date: June 1, 2013

DELAWARE, OH – Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMs and IC cooling applications, introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for spin coating and processing on MEMS and IC wafers.

The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The NR-2500 photoresist is tougher (less brittle) than other negative photoresists in the market with a glass transition temperature of 165°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature providing for chemical and moisture resistance. The NR series is available in various solids/viscosities that can achieve from 2-40 µm thickness in a single layer.

NR-2500 photoresist is compatible with the EMS line of dry-film photoresists. NR-2500 liquid photoresist is the latest addition to the company’s full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.

For more information about the new NR-2500 Liquid Negative Photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.

About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.


Contact:         
Joel Provence
Electronics Materials Manager
740-203 2947        
E-mail: jprovence@emsadhesives.com
Web site: www.emsadhesives.com



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