High-Resolution Camera Module has low-profile design.
Press Release Summary:
Targeting next-generation, ultra-thin smartphones and tablet devices, TCM9930MD uses flip-chip structure for image sensor. Integrated image pre-processing LSI (companion) chip provides distortion correction and performs image resolution reconstruction, resulting in CMOS image sensor camera module with 13 MP imaging capabilities and 4.7 mm profile.
Original Press Release:
Toshiba Announces Thinnest Camera Module With High Resolution, 13 Mega Pixel, Image Sensor for Top-Quality Pictures
New Camera Module Will Drive Next-Generation, Ultra-Thin Smartphones and Tablets
SAN JOSE, Calif. -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announces the industry's thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel (MP), imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry's lowest profile at just 4.7 mm in height.
Achieving today's high-resolution CMOS image sensors requires a larger optical size for corresponding lenses which results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height is to modify the optical lens design which becomes problematic due to resolution drop around the corners of the image area. The TCM9930MD, however, resolves this drop in resolution with the use of the image pre-processing LSI (companion) chip that provides distortion correction and performs image resolution reconstruction(1). Additionally, the TCM9930MD achieves its low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip-chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.
"Toshiba once again proves its technical expertise in the development of this ultra-low height module enabling customers to create the thin, attractive mobile products that consumers have come to expect," says Andrew Burt, vice president of the Analog and Imaging Business Unit, System LSI Group at TAEC. "Our strategy of continuous innovation and enhancement to the TAEC systems offering, especially for the camera/imaging markets, provides the technology solutions that will drive thinner mobile devices without compromising picture quality or performance."
Pricing and Availability
Sample pricing for the TCM9930MD camera module is set at $80 (U.S.). The TCM9930MD is expected to be available in sample quantities by May 2013.
About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 WW Semiconductor Preliminary Revenue Ranking, December, 2012). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jspor from your TAEC representative.
(1) Resolution reconstruction adopted for this new product is a super-reconstruction technology developed by Toshiba corporate research and development center.
AGENCY CONTACT:
Nancy Sheffield
Acclaim Communications
Tel.: (408) 410-9928
nsheffield@acclaimcomms.com
COMPANY CONTACT:
Deborah Chalmers
Toshiba America Electronic Components, Inc.
Tel.: (408) 526-2454
deborah.chalmers@taec.toshiba.com
