HPL Dielectric Material delivers superior heat transfer.
July 19, 2010 -
At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower operating temperatures, which subsequently extends LED lifetimes and durability in HPL applications.
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|Original Press release |
18930 W. 78th St.
Chanhassen, MN, 55317
New Thermal Clad® Dielectric Provides Superior Heat Transfer for High Power Lighting LED Applications.
Thermal Clad HPL (High Power Lighting) offers a cost-effective solution for minimal thermal impedance and efficient heat transfer.
CHANHASSEN, MN - Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB line. HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38µm) has an ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018).
Bergquist Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards (PWB's). The low thermal impedance of Thermal Clad dielectrics outperforms other PCB materials and offers a cost effective solution, eliminating additional LEDs for simplified designs and an overall less complicated production process. Use of Thermal Clad results in lower operating temperatures, substantially extending LED lifetimes and offering better durability for high power lighting applications.
Bergquist Thermal Clad HPL is available in scored array circuits, scored singulated circuit, punched singulated parts and in LED standard stars and squares configurations. For pricing or immediate technical information, please visit www.bergquistcompany.com or call 1-800-347-4572 and ask for a Sales Representative.
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating Gap Fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.