Product News: Adhesives & Sealants, Materials & Material Processing
Epoxy Potting Compound withstands temperatures up to 392°F.
Press Release Summary:
April 3, 2012 - Used to encapsulate small electrical components in medical device industry, EC-1014M-1 meets NASA outgassing standards and offers optimal performance in extreme environments of heat and caustic chemicals. Thermally conductive potting compound provides Shore D hardness of 90 when cured, which enables resistance to physical shock. In addition to pint, quart, gallon, and 5 gallon sizes, product is available as premixed and frozen syringes.
Original Press Release
High Temperature Epoxy Potting Compound
Press release date: March 29, 2012
EC-1014M-1, a new high temperature resistant,thermally conductive potting compound developed by Epoxyset Inc., is now used to encapsulate small electrical components used in the medical device industry. EC-1014M-1 is a custom formulated epoxy potting compound designed to withstand temperatures of up to 200°C (392°F). The product demonstrates excellent thermal characteristics and heat dissipation.
EC-1014M-1 meets NASA outgassing standards and has excellent performance in extreme environments of heat and caustic chemicals. Its hardness when cured is greater than Shore D 90 which provides excellent resistance to physical shock.
EC-1014M-1 is supplied from stock in standard pint, quart, and gallon, 5-gallon, and drum kits. It is also available as premixed and frozen syringes manufactured at our facility in RI. For more information about this advanced, new product, please contact Epoxyset's Technical Sales Department.