Dry Film Adhesive cures at 150°C.August 28, 2009 -
Pre-manufactured with thickness uniformity, DuPont(TM) PerMX(TM) 3000 can cover or tent holes in substrate and provide reliable bonding in 5 min cycle. Negative tone, photodielectric epoxy material offers both corrosion and chemical resistance. With greater than 4:1 aspect ratio, straight vertical sidewalls, and thermal resistance, product is suited for applications in 3D, through silicon via, and wafer level packaging of electronic components and microelectromechanical systems.
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Original Press release
DuPont
14 W. Alexander Dr.
Research Triangle Park, NC, 27709-4425
USA
DuPont Wafer Level Packaging Solutions Introduces PerMX(TM) 3000 Photodielectric Dry Film Adhesive
RESEARCH TRIANGLE PARK, N.C., Aug. 19, 2009 -DuPont Wafer Level Packaging (WLP) Solutions, part of DuPont Electronic Technologies, has introduced DuPont(TM) PerMX(TM) 3000 photodielectric dry film adhesive. This is the first in a new series of permanent photodefinable, low temperature cure epoxy materials uniquely suited for applications in three dimensional, through silicon via (3D/TSV) and wafer level packaging of electronic components and microelectromechanical systems (MEMS). The product was developed in cooperation with MicroChem Corp., a wholly owned subsidiary of Nippon Kayaku Co., Ltd.
"Dry film has strong, inherent benefits for manufacturers of wafer level and 3D/TSV packages," said Mats J. Ehlin, global business manager -- DuPont Wafer Level Packaging Solutions. "It delivers high productivity; involves fewer process steps and has environmental advantages over other technologies. PerMX(TM) 3000 comes pre-manufactured with excellent coating quality and thickness uniformity, and can cover or 'tent' holes in the substrate. We've created a unique product with PerMX(TM) 3000 that demonstrates reliable bonding in a short five minute cycle and cures at only 150° C, which makes it very attractive for components with a tight temperature budget."
PerMX(TM) 3000 photodielectric dry film adhesive is an innovative negative tone photodefinable epoxy material with enhanced corrosion resistance due to the use of a proprietary low chlorine resin technology. High definition and strong chemical resistance also makes PerMX(TM) suitable for microfluidic devices. It has high resolution (> 4:1 aspect ratio), straight vertical sidewalls and good thermal resistance. Further, it shows adhesion, high tensile strength, toughness and flexibility, that is unique for an epoxy based material.
Because it is a dry film, PerMX(TM) is environmentally preferable to liquid photoresists. There is significantly less waste than with liquid spin coating processes and there is no drying of solvents in the application process. In addition, shipping and handling of dry film rolls is safer than shipping solvents and liquids.
Qualifications are currently under way for WLP of CMOS/CCD cameras and various types of radio frequency components, such as acoustic wave filters and resonators. Additional application areas for PerMX(TM) 3000 photodielectric dry film adhesive include bonding for 3D packaging, dielectric layers for WLP, and cavity packaging of MEMS devices.
DuPont Wafer Level Packaging Solutions is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for rigid and flexible circuits, and materials for advanced displays. For more information, please visit http://wlpsolutions.dupont.com.
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.
The DuPont Oval Logo, DuPont(TM), The miracles of science(TM) and PerMX(TM) are registered trademarks or trademarks of DuPont or its affiliates.
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