Product News: Adhesives & Sealants

Conductive Adhesive bonds components to circuit boards.

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Press Release Summary:

October 1, 2013 - Suited for solder replacement applications, CA-102 electrically conductive adhesive has moderate glass transition temperature (Tg) and modulus, exhibits optimized rheology for screen printing, and can be needle dispensed by time-pressure, auger, or positive displacement. Modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces, product suits applications requiring lower stress, lower temperature processing, or elimination of Pb in solder.

Engineered Materials Systems Inc.

132 Johnson Dr., Delaware, OH, 43015, USA

Original Press Release

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Press release date: September 1, 2013

DELAWARE, OH — Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

CA-102 has a moderate glass transition temperature (Tg) and modulus. The adhesive has an optimized rheology for screen printing and can be needle dispensed by time-pressure, auger or positive displacement. CA-102 is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-102 is ideal for applications requiring lower stress, lower temperature processing or elimination of Pb in solder.

CA-102 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-102 Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.

About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

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