March 12, 2013 - Offering alternative to injection molds when encapsulating electronics, 20-2180 Polyurethane Potting and Encapsulating Resin can be poured into metal or silicone mold to create assembly with firm seal around jacketed wires. Rubber-like texture makes it suited for outdoor applications. Resistant to moisture and chemicals, stable and vibration-resistant product has 2:1 mix ratio, self-levels around components, and will not crack. Base is natural oil polyol.

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Epoxies Etc.
21 Starline Way
Cranston, RI, 02921-3407, USA

Consider 20-2180 as an alternative to injection molds when encapsulating electronics

Epoxies, Etc. introduces the 20-2180, a Polyurethane Potting and Encapsulating Resin that has fitting properties for cable and harness assemblies.  The 20-2180 can be poured into a metal or silicone mold to create an assembly with a firm seal around jacketed wires.  Its rubber-like texture makes it ideal for outdoor applications.  It is resilient and won’t crack allowing moisture to creep in. 

Use of the 20-2180 resin in small to medium molding applications is more cost effective than the use of injection molds.  The 20-2180 is stable, pours easily, and resists moisture and chemicals.  It self-levels around components and cures quickly with a small amount of heat.

The 20-2180 is also great for other electronic applications, having a low viscosity, low shrinkage, and creating low stress on components.  It has a convenient 2:1 mix ratio, and its base is a natural oil polyol, which is a renewable resource and low in toxicity.  Go green!

For even greater ease of use, try the 20-2180 in the TriggerBond® dual barrel cartridge system – no mixing or measuring required.

Key Features:
• Sturdy yet not brittle
• Low viscosity
• Moisture and chemical resistant
• Vibration resistant
• Low shrinkage & exotherm
• Easy to use and available in TriggerBond®
• Low toxicity

Samples are available and may be requested from our website: www.epoxies.com

Contacts: View detailed contact information.