Capillary suits copper wire bonding applications.
April 22, 2004 - CuPRA™ handles copper wire from 0.8–3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd.
Willow Grove, PA, 19090
USA
Kulicke & Soffa Launches New Capillary Engineered For Copper Wire Bonding Applications
Willow Grove, PA – April 20, 2004 – Kulicke & Soffa has announced a new copper capillary called CuPRA™ for the semiconductor industry. Specifically engineered for all types of IC wire bonding, the CuPRA capillary can handle a wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications. A part of the new K&S Copper Wire Bonding process technology, this versatile copper capillary can handle copper wire from 0.8 mil to 3.0 thicknesses.
Dr. Ilan Hadar, Vice President –Materials Business Unit at K&S, states, “The new K&S copper capillary offers superior bonding tool durability to offset the engineering challenges of copper’s natural abrasiveness, which has been a challenge in the past with many of our customers.”
Additionally, Yair Alcobi, K&S Bonding Tools Director of Marketing, noted that our CuPRA capillary has been successfully tested on various applications at the world’s leading assembly houses and has been proven to last longer than conventional capillaries in similar applications.
The CuPRA capillary offers superior bonding performance comparable to gold bonds on various pad materials. Today’s copper bonds offer greater reliability with lower inter-metallic growth rates and improved wire looping consistency due to its relative higher stiffness.
Jack Belani, Vice President, Marketing and Business Units at K&S states, “The CuPRA capillary is another example of the innovative and technologically advanced products that K&S is developing in support of customers with transition plans from Au to Cu. Our customers are pleased that we continue to lead technological development in this emerging and growing area.”
About K&S
Kulicke & Soffa is the world's leading supplier of wire bonding equipment in the semiconductor assembly market.
K&S is the only assembly equipment supplier that also develops and manufactures the products that touch a semiconductor chip’s wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip’s package. These products include: test probes; bonding wire; and capillaries that provide an all-inclusive interconnect process when used with the company’s wire bonding equipment. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages.
Primary markets for K&S products and services include Asia, the U.S., Europe and Japan. Customers in these markets are firms that perform contract assembly of semiconductor devices, as well as merchant and captive manufacturers. Kulicke & Soffa's web site address is http://www.kns.com.
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