BGA Adapters connect 0.50 mm devices to 1.00 mm boards.October 16, 2009 -
Designed to adapt smaller pitch devices to larger footprints, Switch-A-Pitch Adapters eliminate need for laser-drilled microvias on motherboards while enabling use of standard line and trace spacing down to 0.003 in. Adapters have tops with BGA landing pads on 0.50 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch. Operating up to 221°F for FR4 or up to 266°F for lead-free, adapters feature non-solder mask defined pads finished with electroless nickel immersion gold.
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Original Press release
Aries Electronics, Inc.
2609 Bartram Road
Bristol, PA, 19007-6810
USA
New BGA Switch-A-Pitch Adapters from Aries Now Adapt 0.50 mm Devices to 1.00 mm Boards
Bristol, Pa. September 30, 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently added new BGA Switch-A-Pitch Adapters that adapt to pitch bottoms lower than previous models, expanding this unique product line that economically facilitates the use of smaller pitch devices with larger pitch boards.
The new Switch-A-Pitch Adapters have tops where the BGA landing pads are on a 0.50 mm pitch and the adapter bottoms are fitted with BGA balls on a 1.00 mm pitch.
By using Switch-A-Pitch Adapters, manufacturers can avoid high costs by utilizing non-multilevel boards that ordinarily could not be used with 0.50 mm pitch devices. The adapters combine readily available, and therefore less-expensive, larger pitch boards with new, tighter pitch devices. Additionally, components can be added to the designs at a much lower cost due to the open space around the small device at the top of the adapter board.
Designed to adapt smaller pitch devices to larger footprints, the new adapters can reduce high density interconnect (HDI) construction. Switch-A-Pitch Adapters eliminate the need for laser-drilled microvias on motherboards while enabling the use of standard line and trace spacing down to 0.003" (0.076 mm).
The suggested PCB pad size is 0.020" (0.50 mm) for a 1.00 mm pitch. Adapters feature non-solder mask defined (NSMD) pads finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. Boards are 0.062" (1.57 mm) thick FR4 or Rogers 370 HR with 1/2 oz. copper traces on both sides. The adapter can operate up to 221°F (105°C) for FR4 or up to 266°F (130°C) for lead-free.
As part of Aries' Correct-A-Chip Adapter series, the Switch-A-Pitch Adapters save users both time and money. Correct-A-Chip Adapters allow the use of different termination styles or pitches on one board designed for an alternative style or pitch and can be fitted with either active or passive components for added functionality.
Aries adapters are available in assorted forms, such as panelized, adapter only or as a turnkey solution with mounted devices. Specializing in custom design and production, Aries offers standard products as well as special materials, platings, sizes and configurations upon request.
The Switch-A-Pitch Adapters are custom made to customer requirements. Pricing for a typical adapter with 32 positions is $6.50 each in quantities of 1,000. Delivery is four to five weeks ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: http://www.arieselec.com, Data sheet #18106-http://www.arieselec.com/products/18106.pdf. Europe Email: europe@arieselec.com.
READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.
Headquartered in Bristol, Pa., Aries Electronics Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the "intelligent" Correct-A-Chip(TM) product line; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
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