Display Controller supports high-speed MIPI DSI standard.
Press Release Summary:
Supplied in 64-pin, 5 x 5 x 1 mm BGA package, TC358730XBG Mobile Industry Processor Interface (MIPI(TM)) display buffer/controller simplifies design of mobile phones. Its 8 Mb eDRAM provides single-buffer operation for images with up to VGA resolution and automatic double buffering when handling 2 images with resolutions up to HVGA. Along with support for various host and display interfaces, controller offers Magic Square(TM) algorithm for image quality and PWM output for backlight control.
Original Press Release:
Toshiba Achieves Mobile Strategic Initiative Milestone With Launch of Enhanced MIPI(TM) Display Buffer/Controller, the World's First Display Controller to Support the High-Speed MIPI DSI Standard
Simplifies Design of Mobile Phones With Display Resolution Up to VGA, Combines Frame-Buffer Memory and Image-Processing Functions with Support for Multiple Baseband and Display Interfaces
SAN JOSE, Calif., Feb. 12 -- Toshiba America Electronic Components, Inc. (TAEC)*, a leading supplier of functional analog peripheral ICs for mobile applications, today announced a milestone in its recently announced, customer-driven Mobile Strategic Initiative with the launch of an enhanced Mobile Industry Processor Interface (MIPI(TM)) display buffer/controller. Designated TC358730XBG, the device is the industry's first controller to support the high-speed MIPI Display Serial Interface (DSI) specification. With support for a variety of host and display interfaces, the compact, highly integrated IC simplifies design of mobile phones with up to Video Graphics Array (VGA) display resolution. Benefits include reduced component count and lower system power consumption.
"Following on the heels of the TAEC Mobile Strategic Initiative announced last month, the Toshiba industry-leading development of the enhanced MIPI display buffer/controller is a significant milestone that demonstrates the company's commitment to customers building the next generation of cellular handsets," said Andrew Burt, vice president of the Imaging and Communications Marketing Group for the ASSP Business Unit at TAEC. "Based on discussions with our mobile-handset customers and leading baseband/application-processor manufacturers, Toshiba is developing a family of display-buffer solutions that add flexible interface standards to the host and display." Mr. Burt explained that the new MIPI device was based on the core architecture of the existing Toshiba MDDI bridge-client device (TC358720XBG). It reuses the core architecture, replaces the MDDI-host interface with a MIPI-compliant interface and adds a high-speed, serial-output interface.
The TC358730XBG features 8 Mbit of embedded DRAM (eDRAM) to provide flexible image buffering for displays with up to VGA resolution. It provides single-buffer operation for images with up to VGA resolution, and automatic double buffering when handling two images with resolutions up to HVGA. Designed for use across a variety of mobile phone platforms, the TC358730XBG supports the existing MIPI DBI type-B specification for command and video data and the MIPI DPI specification for video data plus the MIPI DBI type-C baseband-interface standards for command data. The controller also supports the upcoming high-speed serial MIPI DSI baseband interface for command and video data. It provides LCD-module interface support for parallel MIPI DPI interfaces as well as for a common high-speed serial interface.
TC358730XBG helps reduce system-power consumption by accepting high-speed, burst-access data transfer from the host, which can then enter low-power sleep mode while the controller updates the connected LCD at the required frame rate. A low-power eDRAM implementation, low-leakage process technology and 'Sleep' and 'Deep Sleep' modes also contribute to reduce power consumption.
On-board image-processing functions include pixel doubling to scale lower resolution images up to higher resolution displays, rotation of incoming images, and the mirroring of both incoming and outgoing images. In addition, Toshiba integrated its patented Magic Square(TM) algorithm into the new controller to provide sophisticated image-quality enhancement capabilities. With the algorithm, an RGB666 18-bit LCD panel can produce picture quality equivalent to an RGB888 24-bit LCD panel with up to 16-million colors.
Integration of a pulse-width modulation output for flexible backlight control and a MIPI DBI type-C master for display control offers additional space and component-count savings. A MIPI DCS-compliant software interface allows rapid software integration by the handset manufacturer.
Product features in summary:
o Supports up to 3 host-interface standards
o Supports the primary LCD display plus a secondary LCD display through DBI type C
o Features a MIPI DBI Type B host interface with parallel RGB plus DBI Type C and DSI
o Integrates 8 Mbit eDRAM for frame-buffer memory
o Provides voltage of 1.8 volts (V) for the I/O, 2.3V to 2.9V for the eDRAM, 1.2V for internal-core operation and 1.8V for external-core operation
o Packaging is a compact 64-pin BGA with dimensions of 5mm x 5mm x 1mm
Pricing and Availability
TC358730XBG is being sampled to select customers now. Sample pricing is projected to be in the range of $20.00 to $25.00 each in 10,000-piece quantities. Volume production is planned to start in the second half of 2007.
About the MIPI Alliance and the DSI and DCS Specifications
The Mobile Industry Processor Interface (MIPI) Alliance is a collaboration of mobile industry leaders with the objective to define and promote open standards for interfaces to mobile application processors. The MIPI Display Serial Interface (DSI) and Display Command Set (DCS) specifications, announced in May 2006, are the latest in a series of MIPI standards published or planned by the MIPI Alliance. DSI is based upon the MIPI D-PHY physical-layer specification, a robust, high-speed, low-power, scalable serial interconnect. DCS is an application-layer specification for smart display panels.
About the TAEC Mobile Strategic Initiative
Unveiled in January, 2007, the TAEC Mobile Strategic Initiative is a comprehensive program to help the company's U.S.-based mobile handset/mobile terminal customers achieve faster time-to-market and stay competitive. Over a twelve- to fifteen-month timeframe, TAEC plans to roll out an expanded product portfolio, including newly developed products as well as products never offered before to the U.S. market. These discrete-analog and mixed-signal building blocks provide the connectivity between the baseband and various functions, including the display, camera, keypads and external storage devices. The TAEC customer-driven solutions offer flexibility and modularity across multiple platforms, including the ability to tailor solutions to customer needs as a customer-specific standard product (CSSP). Along with these products, TAEC provides local application and design-in support. In addition, TAEC will offer all necessary support tools for customer evaluation, including evaluation boards, development boards and reference designs.
*About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's largest semiconductor manufacturer and the world's fourth largest semiconductor manufacturer. In more than 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
All trademarks and tradenames used herein are the properties of their respective holders. MIPI is a trademark of the Mobile Industry Processor Interface Alliance.
CONTACT: Judy Kahn, +1-650-948-8881, judith.kahn@comcast.net, for Toshiba America Electronic Components, Inc.; or Deborah Chalmers of Toshiba America Electronic Components, Inc., +1-408-526-2454, deborah.chalmers@taec.toshiba.com
