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Circuits Assembly Awards Seika Machinery for Test & Inspection - ICT

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Seika Machinery, Inc.

3528 Torrance Blvd Suite 100, Torrance, CA, 90503, USA

Original Press Release

Circuits Assembly Awards Seika Machinery for Test & Inspection - ICT

Press release date: March 1, 2014

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – ICT for its HIOKI FA1240 Flying Probe Tester. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO.

The HIOKI FA1240 Flying Probe Tester provides end-users a multitude of benefits compared to conventional test equipment. Some of these benefits include fixture-less inspection for quick setup, an exclusive solder joint integrity test function helping eliminate latent defects due to poor solder joints, a soft landing feature preventing component or board damage, and more.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information about Seika Machinery, Inc., visit www.seikausa.com.

About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

Contact:
Seika Machinery, Inc.
310-540-7310
E-mail: info@seikausa.com
Web site: www.seikausa.com

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