SemiGen Purchases Palomar 8000 Automatic Ball Bonder to Address the Automated Assembly Needs of RF/Microwave and Optical LED Manufacturers
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920 Candia Road
Manchester, NH, 03109
Press release date: May 8, 2012
Manchester, NH - May 8, 2012 - SemiGen, Inc., an RF/Microwave assembly and automated PCB manufacturing house, has announced today they have placed an order for a Palomar 8000 Auto Ball Bonder to round out their state-of-the-art RF/Microwave assembly line.
The Palomar Bonder will be used to compliment SemiGen's MRSI eutectic die attach machine and address the RF/Microwave and optical market requirements for high-speed, ultra-precise, wire bonding. Jim Morgan, President of SemiGen, stated, "This was the last piece of our ultra-modernization plan for our assembly floor and puts us in the leadership position in the U.S. for RF/Microwave assembly and test. It gives us a true competitive advantage to address all markets and volumes."
The Palomar 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. It is the assembly method of choice for first level interconnection and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.
The planarBump(TM) feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes that 8000 Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000 Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications.
The Palomar Technologies 8000 Wire Bonder also features continuous bonding technology - the ability to load parts onto the wire bonder while it is wire bonding.
About SemiGen, Inc. Established in 2009, SemiGen is a contract manufacturing and supply resource for RF/Microwave and PCB related industries. Services include RF hybrid assembly, semiconductor die packaging, automated PCB manufacturing and testing. They're also a fully stocked provider of RF/Microwave manufacturing supplies. Partnering with SemiGen allows component and subsystem suppliers opportunities to reduce manufacturing costs and meet challenging deadlines. Serving the military electronics, commercial device, and medical instrumentation markets, their production line and test department is capable of handling prototype through high volume requirements. For more details, visit www.semigen.net
About Palomar Technologies Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com
Company Contact: Jim Morgan
Agency Contact: Molly Heyward
920 Candia Road