Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO
Nihon Superior Co. Ltd
NS Bldg., 1-16-15 Esaka-Cho
Suita City, Japan
Press release date: January 1, 2013
OSAKA, JAPAN- Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce a range of newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields. These products will be displayed in Booth #833 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in San Diego, CA.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effect joints to most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperature without the need for external pressure. By controlling the sintered microstructure the modulus of the joint can be tailored to accommodate strains arising from CTE differences between a die and a substrate without overstressing the die. After sintering, the melting point of the silver returns to the 961°C of bulk silver so that the joint retains its integrity at high operating temperatures. As such it is ideally suited to the attachment of power semiconductor dies that can achieve maximum efficiency at higher operating temperatures. The Alconano nano-silver pastes can thus be considered a Pb-free replacement for the >85% Pb solders that are currently used in this application.
SN100C7A is a lead-free solder for use in applications such as power modules that have to operate at high temperatures. The high volume fraction of intermetallic particles with controlled morphology means that the material retains adequate strength at temperatures above its 227°C solidus temperature.
SN100C P810 D4 is a lead-free solder paste that has been formulated to minimize voiding by managing the release of volatiles during the reflow profile and minimizing surface tension to facilitate the escape of gas bubbles before the joint freezes. Bubble escape is also facilitated by the eutectic behavior of the SN100C alloy. While this formulation significantly reduced voiding even in conventional reflow, voiding can be reduced to levels well below tightened industry targets if used in combination with vacuum reflow. Low voiding is becoming more important in joints, such as those to power devices that have to have maximum thermal conductivity as well as electrical conductivity.
Nihon Superior's Completely Halogen-Free Fluxes contain no intentional additions of F, Cl, Br or I hidden in the chemistry.
In the development of SN100C P604 Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive and does not use any chemicals requiring special registration under the EU REACH legislation without compromising on performance or reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes. The optimized Thixotropic Index and a high degree of tackiness on PCB finishes ensure excellent printability with high paste transfer efficiency and a slump resistant deposit. The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints.
SN100C (044) completely halogen-free high performance flux-cored solder wire makes it possible to achieve a high first-pass yield due to its excellent wetting and spread, while providing approximately 30 percent faster soldering speeds in manual soldering when compared to the company's previous halogen-free flux-cored solder wire.
NS-F901 is a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, allowing high topside board temperatures (up to 125°C) and long dwell times that may be required for thick boards and dense, complex assemblies, while being environmentally friendly. NS-F901 is specifically designed for use with SN100C lead-free solder but is applicable to all lead-free alloys as well as Sn-Pb in wave soldering.
For more information about Nihon Superior's new solder pastes and lead-free products, meet company representatives in Booth #833 at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.
About Nihon Superior Co., Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
Nihon Superior Co., Ltd.
Overseas Sales Section
NS Bldg., 1-16-15 Esaka-Cho,
Suita City, Osaka,
Web site: www.nihonsuperior.co.jp/english