Indium Corporation Hires Product Manager for Semiconductor Packaging Materials |
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Indium Corporation
1676 Lincoln Ave., P.O. Box 269
Utica, NY, 13502
USA
Press release date: November 21, 2006
Indium Corporation announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials. Andy is based at Indium's Global Headquarters in Clinton, NY, and reports to the Director of Solder Products.
Andy is responsible for the global marketing efforts for all of Indium's Semiconductor Packaging Materials, including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes.
Andy has over 17 years of experience in new product development, sales, and marketing of electronics assembly and semiconductor packaging. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. He received the IPC President's Award in 2001 for his leadership in IPC's Solder Paste Task Force and the Assembly and Joining Materials Subcommittee.
Andy has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science in Surface and Colloid Chemistry from the University of Bristol, UK. He is trained in Six Sigma "Design of Experiments" and has written numerous papers which have been published globally.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com or email askus@indium.com.
Contact: Anita Brown, Corporate Communications Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502
www.indium.com
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