ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business

Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014

Print | 
Email |  Comment   Share  

Altera Corp.
101 Innovation Drive
San Jose, CA, 95134
USA



Press release date: January 27, 2014

Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs

SAN JOSE, Calif. – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.  Altera experts in high-speed SERDES, signal integrity, jitter and packaging technology will showcase Altera technologies being developed today and how they will drive future high-speed communications systems, including CFP4 optical module interconnects, 56 Gbps chip-to-chip interconnects, 25+ Gbps backplane and heterogeneous multi-chip integration. Altera participation at DesignCon 2014 includes in-booth silicon demonstrations, panel discussions, paper presentations and tutorials.

The industry-leading transceiver technology Altera offers today forms the backbone of high-end networks and communications infrastructure. Altera's transceiver technology delivers the industry's highest serial bandwidth, enabling the evolution of backplane and high-speed optical networking systems. The innovations Altera has made in transceiver technology over generations of products provide the foundation for future development of transceivers to drive CEI-56G links that will offer the connectivity to drive the next generation of 400G optical networks, 400G line cards and beyond.

At DesignCon 2014, Altera is demonstrating in silicon several key capabilities that will be offered as part of the company's Generation 10 portfolio of products, including a 25G backplane demonstration and an interoperability demonstration between a Stratix® V FPGA and next-generation low-cost, low-power CFP4 modules.

In-booth Demonstrations:

-  In the TE Connectivity booth #607, Altera, Texas Instruments (TI) and TE Connectivity will show a 25G backplane demonstration featuring Stratix V GT FPGAs and TI re-timers. The demonstration shows key interoperability for enabling next-generation backplane ecosystems.
-  In the Yamaichi booth #519, Stratix V GT FPGAs are being used in a CFP4 active copper cable demonstration, showing the interoperability between the FPGA's 28-Gbps transceivers and Yamaichi's CFP4 module and cable assembly components. The technology being demonstrated today will enable future 400G Ethernet systems.

In addition to silicon demonstrations, Altera experts will showcase innovations in transceiver and semiconductor design with DesignCon attendees through papers, panels and tutorials. For a complete schedule of Altera events visit http://www.altera.com/designcon.

About Altera

Altera® programmable solutions enable designers of electronic systems to rapidly and cost effectively innovate, differentiate and win in their markets. Altera offers FPGAs, SoCs, CPLDs, ASICs and complementary technologies, such as power management, to provide high-value solutions to customers worldwide. Follow Altera via Facebook, Twitter, LinkedIn, Google+ and RSS, and subscribe to product update emails and newsletters. Visit http://www.altera.com.

ALTERA, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at www.altera.com/legal.

Editor Contact:
Steve Gabriel
Altera Corporation
(408) 544-6846
newsroom@altera.com

Source
Altera Corporation

Web Site: http://www.altera.com




Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
 Visit Green and Clean Blog
  Latest from the Green and Clean Blog
 See more product news in:
Computer Hardware and Peripherals
Electronic Components and Devices
Mechanical Components and Assemblies
Green & Clean
 More New Product News from this company:
FPGA and SoC Devices comply with military temperature specs.
EDA Software aids 20 mm SoCs and FPGA design.
Design Software supports 14 nm FPGAs.
FPGAs and SoCs provide more than 4 million logic elements.
Power Conversion Driver/MOSFET works with high-performance FPGAs.
More ....
| Featured Manufacturing Jobs
 Other News from this company:
Hollywood's Top-selling Camera Maker ARRI Chooses Altera for AMIRA Documentary Camera
Altera Demonstrating FPGA-based Data Center Solutions at Intel Developers Forum 2014
Altera to Demonstrate FPGA Technologies at Flash Memory Summit 2014
Altera and Lime Microsystems Team up to Accelerate and Simplify the Development of Wireless Networks
Altera Delivers Early Access Software for Next-Generation, Non-Volatile FPGAs
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-mail this story to a friend
Save Story
Search for suppliers of
Programmable Logic Devices
Central Processing Unit (CPU), Intellectual Property (IP), Microprocessor & Processor Cores
Integrated Circuits (IC)
Transceivers
Backplanes
Gate Arrays
Wire Communications Semiconductors
Network Semiconductors
Power Semiconductors
Semiconductors
Join the forum discussion at:
Tools of the Trade
Wired In


Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2014 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy



Error close

Please enter a valid email address