New High-Voltage NMOS/PMOS Devices are Based on XT018 BCD-on-SOI Platform with Deep Trench Isolation
Provides more flexible voltage offering up to 200V to support the battery cells. Operating voltages from 70V to 125V. Support automotive AEC-Q100 Grade 0 products.
Read More »ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers
ANSYS power, noise and reliability solutions assist power-efficient IP design for ARM PITTSBURGH - ANSYS (NASDAQ: ANSS) has licensed its engineering simulation software tools to ARM (LON: ARM; Nasdaq: ARMH), the world's leading semiconductor intellectual property (IP) company for power efficiency, performance and reliability. The agreement will aid the ARM ecosystem and ARMÃ-® processor...
Read More »SK Telecom and Broadcom Enable First 4G LTE Small Cells with Carrier Aggregation Features
Innovative 4G LTE Small Cells Deliver Seamless Mobile Experience IRVINE, Calif. –Ã- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that SK Telecom, Korea's largest telecommunications company, has selected Broadcom's latest small cell system-on-chip (SoC) devices with carrier aggregation...
Read More »System Semiconductor calculates distance using one camera.
Offering performance exceeding 30 fps, DR1151 uses Dual Aperture's 4-color 3D image solution technology, which extracts RGB and IR signalsÃ- from single image sensor, to calculate relative distance to object withÃ- single-lens camera. Application ofÃ- self-developed hardware blocks to process calculations required for extracting relative distance minimizes power consumption, which...
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Bearing Solutions For Recreational Applications
This white paper provides and overview of bearing solutions for recreational applications.
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X-REL Semiconductor Presents the XTR20410 and XTR20810 High-Temperature Families of N-channel Power MOSFET with Integrated Driver
Grenoble, France,Ã- – X-REL Semiconductor, the innovation leader in high-temperature and high-reliability semiconductors, unveils two new product families targeting power conversion applications in highly demanding markets including aerospace, industrial, hybrid and electric vehicles, transportation, geothermal and oil and gas. The XTR20410 and XTR20810 product families consist of extremely...
Read More »Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014
Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs SAN JOSE, Calif.Ã- – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.Ã- Altera experts in...
Read More »Digi Adds Android Support for the ConnectCard for i.MX28 Wireless Module
-iDigi Device Cloud enables rapid development of cloud-connected Android devices- MINNETONKA, Minn.Ã- -Ã- Digi InternationalÃ- (NASDAQ: DGII) today announced it will offer Android support for the ConnectCard™ for i.MX28 module, a compact wireless system-on-module for developing connected devices based on Freescale™ Semiconductor technology.Ã- Embedded application development...
Read More »STMicroelectronics and Soundchip Introduce Components to Create Smart High-Definition Audio Accessories that Dazzle
Powerful new audio engines combined with high-performance MEMS microphones enable feature-rich, software-controlled headsets that take personal audio to the next level Geneva, Switzerland – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance audio ICs, together with Soundchip,...
Read More »Triple Gate Oxide CMOS Process suits mixed signal applications.
Able to support wide voltage ranges, 0.13 Ã-µm triple gate oxide CMOS process is fully compatible with standard CMOS process and designed to keep all device parameters unchanged within process variation ranges. Additional layer of gate oxide introduces 1.8 V CMOS into standard 1.2/3.3 V CMOS array on 0.13 Ã-µm technology. Using modular characteristic for IC design provides flexibility,...
Read More »TI Introduces World's First Configurable NDIR Gas Sensing and PH Sensing AFEs
Single-chip solutions simplify design & accelerate time-to-market DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two configurable analog front ends (AFE) that provide an easy-to-use, modular solution for bridging the gap between the microprocessor and sensor. Design engineers can dramatically reduce their development time by using a single AFE across multiple...
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Delivery Equipment That Really Delivers
Are you in need of safer, more efficient transportation equipment? Do you feel like your delivery equipment could really use an upgrade? Check out this video, and learn about Halo Ramp Company's patented safety platforms, and how they help you bypass your trickiest delivery challenges.
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