New SPAD and APD Products by X-FAB Suits for Deployment in Automotive Systems
Applications are proximity sensing, LiDAR, time of flight (ToF), medical imaging (CT and PET) and scientific research. Offers low dark count rate (<100 counts/s/µm²) and wavelengths are 40% at 400nm. Provides strong linear gain figure and fully scalable.
Read More »
New Semiconductor Packages Operate from DC to 63+ GHz
Dissipates heat from compound semiconductor devices such as gallium nitride gallium arsenide and silicon carbide. Enables compound semiconductor devices to meet critical requirements of markets such as telecom, mixed signal and MEMS.
Read More »
Microchip Announces Production Release of Silicon Carbide (SiC) Products That Enable High-Voltage, Reliable Power Electronics
700 Volt (V) MOSFETs and 700 V and 1200 V Schottky Barrier Diodes (SBDs) extend customer options as demand grows for SiC technology's efficiency and power density CHANDLER, Ariz., April 30, 2019 /PRNewswire/ -- Demand is growing for SiC power products that improve system efficiency, robustness and power density in automotive, industrial and aerospace and defense applications. Microchip...
Read More »
Littelfuse Exhibits Power Semiconductor Products at Applied Power Electronics Conference & Exposition
Broad product offering helps enable emerging automation, electrical vehicle and renewable energy applications CHICAGO, March 18, 2019 — Littelfuse, Inc. (NASDAQ: LFUS), a global manufacturer of leading technologies in circuit protection, power control, and sensing, is exhibiting its broad portfolio of power semiconductor devices at this week’s Applied Power Electronics Conference &...
Read More »
Understanding Crane and Hoist Classifications
Building success: Crane & Hoist Design Criteria
Read More »MagnaChip Introduces Bipolar-CMOS-DMOS Technology That Offers Specific On-Resistance of Power LDMOS
The Bipolar-CMOS-DMOS BCD Process Technology is suitable for PMIC, DC-DC converters, battery charger ICs, protection ICs, motor driver ICs and LED driver ICs. The technology with low Rsp LDMOS helps in reducing chip size and power loss of power ICs. It is used for generating diverse combination of 1.8V, 5V, and 12~40V transistors. The BCD process technology provides various optional devices such...
Read More »MagnaChip Introduces 0.18 Micron BCD for High Voltage Applications
MagnaChip now offers Foundry customers a 0.18 micron BCD (Bipolar-CMOS-DMOS) 200V high-voltage process using SOI (Silicon On Insulator) substrates with solid high-voltage isolation and extends MagnaChip's existing BCD processes from 100V to 200V. This process enables a Power IC to be designed for high voltage applications like automobiles, electrical vehicles, industrial motor drivers,...
Read More »
New High Temperature TRIAC from Littelfuse is Suitable for Internet of Things (IoT) Applications
LittelFuse’s offers LJxx04xx and QJxx04xx (4-Amp), LJxx06xx and QJxx06xHx (6-Amp) and LJxx08xx and QJxx08xHx (8-Amp) TRIACs in TO-251 (VPAK) or TO-252 (DPAK) packages. The units are suitable for 24 VAC control, 110 VAC, AC solenoid/valve control, AC heating control and AC motor control applications. It features a maximum junction temperature of 150°C and a high surge capability simplifies...
Read More »
Rigaku Presents Latest Semiconductor Metrology Solutions at SEMICON West
Rigaku showcases its X-ray analytical instrumentation for the semiconductor industry at SEMICON West 2018 SAN FRANCISCO (PRWEB) JULY 11, 2018 - Rigaku Corporation is in attendance at SEMICON West 2018. Semicon West is the premier event for the global microelectronics industry, highlighting the latest innovations, products, processes, and services for the design and manufacture of the most...
Read More »
StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...
Read More »
Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...
Read More »
Aerzen USA Process Gas Blower and Compressor Installations Worldwide
Aerzen is firmly established as a global leader in compressed air, gas, and vacuum solutions. Our reputation as an industry leader is built on consistently delivering innovative products that are at the cutting edge of technology. To learn about the industries finest blowers and oil-free and oil-injected screw compressors, see our video.
Read More »
