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Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week

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Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week
Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week
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Agilent Technologies, Inc.
5301 Stevens Creek Blvd.
Santa Clara, CA, 95051
USA



Press release date: October 23, 2012

SANTA CLARA, Calif. Agilent Technologies Inc. (NYSE: A) today announced that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

EMPro 2012 makes it easier for designers to create 3-D models and analyze the electrical performance of packages, connectors, antennas, and other RF and high-speed components. During European Microwave Week, attendees will get a closer look at the software, while also having the opportunity to check out Agilent's newest microwave, millimeter-wave, wireless, radar, and antenna test and measurement solutions for the telecommunications, transportation and medical markets. To complement these demonstrations, Agilent will also host a comprehensive series of workshops and technical programs.

EMPro 2012 features unparalleled integration with Agilent's Advanced Design System software, as well as several simulator enhancements to improve performance and accelerate product development. The increased level of integration with ADS is based on a shared database approach. Three-dimensional objects in EMPro can now be saved as ADS design database "cells" for use directly in ADS. As an example, a 3-D SMA connector cell created in EMPro now has "cell views" that can be placed either directly in an ADS schematic for circuit/electromagnetic cosimulation, or in an ADS layout (for an RF printed circuit board, for example) for full 3-D EM simulations in ADS.

EMPro 2012 also includes several advances in EM simulation technology. A new low-frequency analysis algorithm improves accuracy below 100 MHz, including at DC, in finite element method simulations. Traditional FEM solvers have had difficulty producing accurate, stable results at DC and low frequencies, which is required in subsequent circuit simulations, even for higher frequency applications. Additionally, EMPro's FEM meshing technology has been enhanced for increased speed (typically 50 percent faster) and robustness.

Agilent invites customers to join the EMPro 2012 beta program. Currently supported Agilent customers interested in the new EMPro 2012 technologies, applications and capabilities should contact their local applications engineer or field sales person for more information.

Availability
The EMPro 2012 release will be available for download in November. Interested parties can evaluate the software by applying for a trial version at www.agilent.com/find/eesof-empro-downloads-and-trials. Application examples covering a wide range of topics, including packaging, antennas, RF PCBs, RF modules, connectors and radar applications can be downloaded at edocs.soco.agilent.com/display/eesofapps/EM+Applications.

More information on EMPro 2012 is available at www.agilent.com/find/eesof-empro.

About Agilent EEsof EDA Software
Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications. More information is available at www.agilent.com/find/eesof.

About Agilent Technologies Agilent Technologies Inc. (NYSE: A) is the world's premier measurement company and a technology leader in chemical analysis, life sciences, diagnostics, electronics and communications. The company's 20,000 employees serve customers in more than 100 countries. Agilent had net revenues of $6.6 billion in fiscal 2011. Information about Agilent is available at www.agilent.com.

Contact:
Janet Smith, Americas +1 970 679 5397 janet_smith@agilent.com

Sarah Calnan, Europe +44 (118) 927 5101 sarah_calnan@agilent.com

Iris Ng, Asia +852 31977979 iris-hw_ng@agilent.com
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